B
oards
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odules
agement of the board and application-specific
peripherals, such as power states or watchdog
setting. The middleware provides a large set
of deeply embedded tools enabling remote
device and system management via the SEMA
Cloud platform and management portal or
custom-specific clouds and services.
ADLINK offers its customers SEMA Cloud
Evaluation Packages, which include licenses
to use the SEMA Cloud for one year and
cover connections of up to 10 or 50 devices
for test and development purposes. Custom-
ers can easily enter the new exciting world of
IoT and test and develop their own IoT solu-
tion with reduced time-to-market (TTM) and
without the need for large investments in new
IT infrastructure. Thus, SEMA Cloud enables
customers to reduce maintenance costs of
their embedded systems and to monetize their
data in a short period of time.
With its A+ Services ADLINK also offers the
entire development of carrier boards for its
COM Express Computer-on-Modules. This
includes system integration from concept to
volume production to reduce development
costs and shorten time-to-market. Many years
of development experience and extensive
expertise in the area of Computer-on-Mod-
ules and carrier board development are the
guarantee for delivering highest quality within
a very short time. Fitted with the latest tech-
nical equipment, the company test labs carry
out the verification of the designs to ensure
conformity with form factor specifications
and relevant interface standards by appropri-
ate compliance tests. Tests include, for exam-
ple, power integrity, signal integrity, thermal
simulation and mechanical stress tests. To
streamline the processes from development to
series production and to ensure highest qual-
ity levels, ADLINK follows a well-established
process. Six process steps transform a cus-
tomer order into a volume-ready product to
be assembled on latest SMT production lines.
For OEMs it is important to be able to rely on
open standard building blocks to build system
platforms that are tailored to the dedicated
needs of customers and which quickly bring
new applications to market. With sixth-gener-
ation Intel Core processors on COM Express
Computer-on-Modules they have the right
solution to cover nearly all the x86 perfor-
mance classes. The ADLINK A+ services
include the design and production of the
entire solution and the responsibility for the
entire system with a single point of contact.
By providing its A+ Services the company
fills this gap and is transformed from a pure
embedded platform vendor into a true end-to-
end service for OEMs. The new cExpress-SL
and Express-SL in PICMG COM.0 Type 6
Compact and Basic size form factors are avail-
able with sixth-generation Intel Core i7, i5
or i3 processors and the accompanying Intel
QM170 and HM170 chipset. In addition, the
Express-SLE COM Express Basic size module
features the Intel Xeon processor E3-15XX
v5 family and Intel CM236 chipset and sup-
ports ECC memory. In all models, a total of
32GB DDR4 memory at 1867/2133MHz is
supported with increased I/O frequencies and
lower voltage compared to DDR3 resulting
in higher data transfer rates as well as reduc-
tion in overall power consumption and heat
dissipation. These new COMs support three
independent UHD/4K displays and hardware
codec H.265/HVEC with Intel Gen9 graphics,
making them well-suited for image-intensive
applications in automation, medical, infotain-
ment and gaming. Models with an extended
operating temperature range of -40°C to
+85°C are also available for transportation and
defense applications.
Latest sixth-generation Intel Core proces-
sor-based COMs from ADLINK also provide
flexible system integration with configurable
TDP (cTDP), which allows developers to
modify processor behavior to the extent that
power consumption and TDP can be adapted
to meet application demands. The 15 watt
Intel Core processor U Series can, for exam-
ple, be configured down to a 7.5 watt TDP, and
the Core i5 and i7 SKUs additionally up to a
maximum TDP of 24.5 watts. One Intel Xeon
processor even has a cTDP that ranges from
35 to 45 watts and addresses the demand of
space-restricted embedded server technology
required for the IoT edge infrastructure. The
rich I/O set includes three DDI channels, one
LVDS (or 4 lanes eDP), up to 8x high-speed
PCIe Gen3, four SATA 6 Gb/s, GbE, four USB
3.0 and four USB 2.0.
n
&
Request and
Design with
Simulation
Prototype
and
Validation
Test
and
Validation
Volume
Production
Final Design
and
Project appproval
Figure 2. Seconding A+ Services for Computer-on-Modules transform the product vendor AD-
LINK into a real ODM service provider for OEMs offering full custom design services on board
and system level.
