September 2016
16
E
mbedded
C
omputing
Gen 3.0 is supported. This allows designers
to double the data rate over PCIe 2.0 based
designs with the same number of lanes. Com-
pared to modules featuring the previous gen-
eration of AMD Embedded G-Series SoCs,
the dual-core AMD GX 217GI processor pro-
vides up to 30% more graphics performance
and 15% more overall system performance.
At the same time, the maximum configurable
TDP remains between 12 to 15 watts, the ideal
range for fanless system designs.
congatec has made the new AMD G-Series
available on COM Express modules that are
also available with R-Series processors to
provide a complete family. This makes the
new module the first choice for many main-
stream applications in the digital signage seg-
ment. OEMs also benefit from extremely high
scalability up to quad-core performance in
the 35 W TDP class that offers game console
level graphics performance on up to three
independent screens and top class GPGPU
performance. Developing solutions ranging
from the entry-level to high-end systems with
only one module design becomes quick and
easy. In the high-performance graphics seg-
ment the new conga-TR3 provides best pric-
ing for high-volume applications. The new
conga-TR3 COM Express Basic module with
Type 6 pin-out is equipped with the dual-core
AMD Embedded G-Series SoC GX-217GI
processor with 1.7 GHz to 2.0 GHz and sup-
ports up to 32GB DDR4 memory, optionally
with ECC. The new AMD Graphics Core Next
(GCN) Generation 3 architecture controls up
to two independent 4K Ultra HD displays @
60Hz via DisplayPort 1.2 or HDMI 2.0. In
safety-critical applications, the integrated
AMD Secure Processor provides hardware-ac-
celerated encryption and decryption of RSA,
SHA and AES.
The new computer module supports COM
Express pin-out Type 6 with 1x4 PCIe 3.0, 1x
PEG, Gigabit Ethernet, 4x USB 3.0 / 2.0, 4x
USB 2.0, SPI, LPC plus I²C, SDIO and 2x
UART. Operating system support is offered for
Linux and Microsoft Windows 10, Windows
8.1 and, optionally, Windows 7. Embedded
Design and Manufacturing Services for cus-
tom carrier boards and a wide range of acces-
sories to facilitate design-in are also offered.
As part of its Embedded Design and Manu-
facturing (EDM) Services congatec offers its
customers everything OEMs need. The spec-
trum ranges from the development of custom
carrier boards to complete digital signage sys-
tems, which congatec realizes with partners
such Technagon. congatec EDM Services start
in the design phase with requirement engi-
neering. Services include the development
of all specific embedded hardware as well as
the required low-level software such as BIOS/
UEFI, driver and OS images, ensuring perfect
integration into the customer-specific appli-
cation. Together with the production-ready
components from Technagon, full advertis-
ing and information systems are designed for
optimum manufacturing, both from a techni-
cal and economic point of view. Among other
things, Technagon covers the display technol-
ogy, including safety glass and anti-reflective
coating technologies required for locations
that are prone to vandalism or direct sunlight.
The service also covers the entire production
cycle and system integration, with the option
of including certification and global logistics
for delivery at the customers of the customer.
OEM customers also benefit from technical
system support.
n
acceed: 24V PoE switch with 8
insulated gigabit ports
PoE switches exist in any given numbers. None-
theless, you need to look for those with a total
power output of 120 W. However, the IGPS-
1080-24V-I, which conjures up a full 50Wwith a
maximumof 30Wfroma switch cabinet-typical
input voltage of only 24 V for all eight Ethernet
interfaces, is virtually unique. The inconspic-
uous abbreviation “I” at the end of the product
name expresses a further special feature: all eight
ports are insulated (overvoltage protection up to
1.5 kV), and the isolation on the input power
side has been enhanced to 1.5 kV.
Vecow: Skylake-S fanless Embedded
workstation system
Vecow launches her latest high performance
embedded box PC with Intel 6th Genera-
tion Skylake platform, ECS-9000 Series Fan-
less Embedded System. With Quad Core
Intel 6th Generation Core i7/i5/i3 processor
(Skylake-S), fanless -40 to 75°C operating
temperature, all-in-one integrated features,
supporting 10G LAN/Fiber, multiple I/O con-
nection, user-friendly, smart manageability,
outstanding system performance, excellent
mobile availability, 6V to 36V power input
with 80V surge protection, ignition power
control, intelligent circus protection and rug-
ged reliability in harsh environments, the
ECS-9000 Series Fanless Embedded System
is your superb choices for Machine Vision,
Intelligent Automation, Smart Manufacturing,
Embedded Cloud, Intelligent Surveillance,
Vehicle Computing, Mobile Robot Control,
and any Industry 4.0 performance-driven
real-time embedded computing applications.
EKF: XMC module carrier supports up
to eight PCI Express lanes
With the SK3-MEDLEY, EKF exhibits a new
CompactPCI Serial carrier card for XMC-
style mezzanine modules. While using a
similar form factor as PMC cards, XMC
modules (ANSI/VITA 42/61) are provided
with the powerful PCI Express interface.
The SK3-MEDLEY is equipped with a PCI
Express Gen3 x8 redriver, for optimum high
speed signal integrity, and should be installed
into a CompactPCI Serial fat pipe slot. The
SK3-MEDLEY can be used with 74x139mm²
size XMC mezzanine cards.
ADLINK: COM Express 3.0 type 7
Computer-on-Module
ADLINK Technology announced its first
computer-on-module based on the latest PCI
Industrial PICMG COM Express 3.0 speci-
fication with new Type 7 pinout, for which
ADLINK lead development efforts to bring a
server-grade platform and 10 GbE capabilities
to aCOMformfactor. ADLINK’s Express-BD7
targets customers building space-constrained
systems in industrial automation and data
communication, such as virtualization, edge
computing or other numerical applications,
that require high density CPU cores balanced
by reasonable power consumption.
b-plus: PC/104-Plus board, perfect for
the retrofitting of existing systems
b-plus offers with its industrial PC/104-Plus
PC104Board DX3 the optimal alternative to
discontinued LX800 CPU based products. To
reduce costly adaptions and new develop-
ments of whole applications and designs, e.g. in
industrial machinery, b-plus developed a main-
tenance free module, that has similar character-
istics. It also offers beneficial new features.
MEN: binary I/O for rail applications
on CompactPCI Serial
The new 3U CompactPCI Serial board G403
with 16 bidirectional digital I/O channels has
been designed specifically for modern railway
applications. The new board is suited for many
different control functions, such as door-lock-
ing control and interior lighting. The G403
supports a total of 16 bidirectional digital
I/O channels, organized into four optically
isolated groups for reliable data transmission
with four channels in each group. In addition
to an accommodating configuration as either
an input or output, each channel features an
individual edge-triggered interrupt.
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