September 2016
8
E
mbedded
C
omputing
cloud for batch processing or archiving. SoC
solutions provide options for cold, warm or
hot storage that scale with performance and
capacity with different cost points, including
M.2 (PCI-e 3.0) storage expansion slots.
Network connectivity provides the ability to
transport small data packets from multiple
smart devices to edge devices and medium to
large packets between edge devices and large
payloads to the cloud. These SoC solutions
can operate as single entities or as fabrics to
avoid a single point of failure. SoC solutions
provide a choice of LAN connectivity ports
with 1G/10G Ethernet speeds, along with
mini-PCIe expansion port for Wi-Fi, ZigBee,
and 3G wireless connectivity options. IoT
platform and solutions providers can unify
hardware requirements that are scalable with
SoC solutions and to address specific vertical
market segments.
X10SDVSoC family with its server-class
capabilities offers the industry the most con-
verged infrastructure and a low total cost of
ownership (TCO) to a wide range of embed-
ded applications. The motherboard is a small
mini-ITX or Flex-ATX form factor solution
providing up to 22 storage devices (16x 6Gbs
SATA3/SAS2 ports, 6x SATA3 ports), 8 LAN
ports (including Dual 10GbE fiber connectiv-
ity), and IPMI for remote management. The
solution is optimized for 1U and 2U rack
environment, including a new 1U solution
for 12x3.5” hot-swap drives and 2U solutions
for 24x 2.5” hot-swap drives. Features include
redundant high-efficiency power supplies,
specially designed optimized cooling, and
dual PCI-e 3.0, Mini PCI-e/mSATA and M.2
expansion slotsfor superior network and addi-
tional storage options.
Powered by the latest Intel® Xeon® processor
D product family with up to 16 cores, the
high-density hyper-scale X10SDV family
provides scalable power and performance
solutions. Based on Intel 14nm process tech-
nology these processors couple lower power
consumption with the performance of up
to 16 cores. The processor family enables
new options for infrastructure optimization,
bringing the performance and advanced intel-
ligence of Intel® Xeon® processors into dense,
lower-power SoCs.
These powerful SoCs include improved cache
sizes and support up to 128GB DDR4 ECC
registered memory. Other advanced proces-
sor features include Intel Virtualization Tech-
nologies (Intel VT-x, VT-d and SR-IOV);
Intel AES New Instructions (Intel AES-NI);
Intel Trusted Execution Technology (Intel
TXT); Intel Advanced Vector Extensions 2
(Intel AVX2); Intel QuickData Technology,
silicon-based reliability, availability and ser-
viceability (RAS); and built-in dual 10GbE
Network Controller.
The X10SDV family is a highly scalable, com-
pact, energy efficient design that provides
outstanding performance for: lightweight
hyper-scale workloads-dynamic web serv-
ing, memory caching, and dedicated hosting,
dense, low-power storage workloads- warm
storage and video-on-demand, and com-
munication workloads - wireless base sta-
tions, routers, switches, security and network
appliances that require hardware-assisted
virtualization, acceleration, and integrated
networking Supermicro promotes the build-
ing block approach to edge computing to
carriers, cloud and data centers to deploy
appliances and related services while respond-
ing to market requirements faster using build-
ing block solutions for the intelligent edge.
n
Figure 1. Computation at the edge
Figure 2. High density scalable SoC solutions -
performance/watt
Figure 3. Block diagram of the X10SDV-
7TP8F Flex ATX motherboard
MEN becomes member of UNIFE
Recently MEN Mikro Elektronik has become
a member of UNIFE. As an expert for safe
and reliable electronics on rolling stock and
wayside, MEN will actively contribute to the
digitalization of the rail market and the devel-
opment of European standards.
congatec: highly flexible
IoT gateway system
congatec introduces its flexible IoT gateway
solution, which is application ready and easily
customizable for rapid field deployment. The
congatec IoT gateway offers extreme levels of
flexibility in terms of processing performance
and software integration, able to host up to
8 wireless antennas that can be connected to
3 mini PCI Express slots and 6 internal USB
based slots for wireless and wired connectivity
modules. Customized system designs are also
available upon request.
DFI: fanless Embedded computer features
Quad Core Atom E3800 processor
DFI Tech now offers a higher performance
quad core processor in its rugged EC series
fanless computing systems. The EC700-BT
Fanless Embedded System from DFI Tech
features an Intel Atom E3845 quad core
1.91GHz processor and 4GB of DDR3L
ECC on-board memory. The lightweight
fanless system is rugged, conforming to
MIL-STD-810F (514-5C-2) for vibration
and can handle 15G half sine wave of shock
for 11 ms in 3 axes.
Artesyn to demonstrate ControlSafe
Platform at InnoTrans
Designed to deliver best-in-class platform
hardware availability of six nines (99.9999%),
Artesyn’s ControlSafe Platform is designed to
meet the functional safety, reliability and avail-
ability requirements mandated by rail stan-
dards and specifications. This makes Artesyn’s
ControlSafe Platform ideal for deployment
in safety application environments to protect
investment in rail infrastructure.
Product News
