Avalue: 3.5” module based on
DMP Vortex86DX2 SoC CPU
Avalue Technology announce the ECM-DX2.
The module which is highly integrated, has
low power consumption design, fanless oper-
ation and extended temperature supported by
using the DMP Vortex86DX2 SoC CPU. Vor-
tex86DX2 SoC CPU is indeed designed for in-
dustrial and embedded applications due to
various integrations of I/Os, compact design,
longevity, ruggedness, and power efficiency.
The SoC integrates CPU, North and South
Bridge, GPU, HD Audio, versatile I/O ports,
ISA, and PCIe bus into a single chip.
Seco: developer kit for NVIDIA’s Tegra K1
mobile processor
SECO informs that the NVIDIA Jetson TK1
Developer Kit is now available for pre-order
on the shop. At the heart of the Jetson TK1
Developer Kit is the Tegra K1 mobile processor,
NVIDIA’s 192-core super chip built on the
NVIDIA Kepler architecture, the world’s most
advanced and energy-efficient GPU architec-
ture for mobile and embedded applications.
The Tegra K1 mobile processor features an
ARM Cortex-A15 32 bit processor which will
also be available as a pin-to-pin compatible
ARMv8 64 bit based processor with all the
graphics performance, parallel computing ca-
pabilities and CUDA library support that
NVIDIA is famous for.
Vecow: fanless Box PC series with Atom
E3845 for IoT and cloud computing
Vecow announce the ABP-2000A series Fanless
Advanced Box PC series. ABP-2000A series
are still equipped with Intel Quad-Core Atom
E3845 processor family (1M Cache, 1.91GHz)
and DDR3L single channel 8GB ram, two
HDMI display, two RS-232, two RS-
232/422/485,
two
isolated
RS-
232/422/485(ABP-2845A only), four GbE
LANs, one 2.5” SATA 3Gp/s SSD/HDD tray,
three USB 3.0 ports, two USB 2.0, and one
miniPCI-express.
Sealevel: isolated digital input boards
support AC and DC voltages
Sealevel Systems announces the addition of
two new digital input boards, the 8510 and
8511, to the SeaRAQ family of I/O expansion
designed for Relio R3 rackmount industrial
computers. Each board provides 16 optically
isolated inputs with 1500 VAC isolation to
prevent damage from harmful voltage spikes
and surges often found in industrial environ-
ments. The boards for I/O intensive applica-
tions include process control, test and meas-
urement, and data acquisition applications.
DFI: compact Embedded chassis
accommodates any 3.5“ SBC
DFI launches ES520 compact embedded chassis
that can accommodate any 3.5” SBCs. With di-
mensions of 166 x 50 x 157.3mm, this compact
embedded chassis can easily fit into any space-
limited environments. The embedded chassis is
design with 1 2.5” SATA drive bay, 4 or 2 optional
USB ports at the front panel, as well as 1 system
fan to promote cooling efficiency. To ensure better
communication, it is also equipped with 2 Wi-Fi
module antenna holesmaking the chassis suitable
for a variety of wireless-concern applications.
VIA: compact ruggedized IoT system
with rich network connectivity
VIA Technologies announced the VIA AMOS-
3003, a compact embedded IoT system
designed around the tiny VIA EPIA-P910
Pico-ITX board. Combining low power, rich
connectivity and high performance 64-bit
computing in a ruggedized design, the VIA
AMOS-3003 delivers all the latest features
and digital media standards required in data
collection terminals for in-vehicle control as
well as machine to machine controllers in a
host of industrial automation applications.
19
June 2014
B
OARDS
& M
ODULES
