June 2014
14
M
ICROCONTROLLERS
Freescale: 2nd generation Kinetis K
series MCUs with ARM Cortex-M4 core
Freescale Semiconductor announce the next
generation of Kinetis K series microcontrollers
with the expansion of its existing Kinetis K1x,
K2x and K6x MCU families, and the intro-
duction of the Kinetis K0x MCU family. In
addition, Freescale has expanded its enablement
software offerings for the entire product line,
providing customers a broad array of MCU
software and tools support, including a new
Kinetis software development kit and Kinetis
Design Studio IDE
TI: tiny package sizes for several new
families of MSP430 microcontrollers
Texas Instruments announced the availability
of tiny package sizes to several new families of
ultra-low power MSP430 microcontrollers.
Developers can now design smaller products
with TI’s ultra-low power FRAM-based
MSP430FR5738
and
Flash-based
MSP430F51x2 MCUs in wafer-level chip scale
packages (WLCSP) as small as 2.0 x 2.2 x 0.3
mm, in addition to the five existing MSP430
MCU families with tiny package options.
Toshiba: new LEDs for general lighting
applications reduce mounting area
Toshiba Electronics Europe has launched a
new series of chip scale package white LEDs
for lighting applications that can reduce the
mounting area by 90% compared to conven-
tional 3.0 x 1.4 mm package products. The
new TL1WK series LEDs have been designed
as light sources for general lighting, including
straight tube lights, light bulbs and ceiling
lights.
Digi-Key: all in one mobile app for
Freescale products
Digi-Key has collaborated with Freescale Semi-
conductor in order to create the electronic
component industry’s first distributor/supplier
collaborative mobile application. In response
to the ever-increasing adoption of mobile de-
vices, Digi-Key designed this new app to en-
hance the user experience for Freescale cus-
tomers by giving them access to all relevant
product information and online ordering re-
sources in an easy-to-use mobile format.
Maxim: 20-bit, 1.6MSPS successive
approximation register
analog-to-digital converter
Engineers can achieve high resolution and
fastest sampling at the low power with the
MAX11905, a 20-bit, 1.6Msps successive ap-
proximation register analog-to-digital converter
from Maxim Integrated Products. Typically,
when engineers require high-precision data
conversion, they turn to a delta-sigma ADC.
However, to produce high precision and wide
dynamic range, those ADCs must consume at
least 100mW of power.
Distec: next generation optical bonding
for TFT displays
Distec uses the currently most advanced optical
bonding technology VacuBond. High-precision
serial production is guaranteed by the auto-
mated process and the homogeneous silicone
material. Clean room conditions ensure that
no dust or dirt particles affect the result. The
manufacturing equipment is capable of directly
bonding TFT displays in custom bezels and
front housings with integrated protective glass.
Mouser: Intel Quark SoC X1000
processors now in stock
Mouser Electronics is now shipping the new
Intel Quark X1000 System on a Chip, the
latest Intel 32-bit processor built for the next
generation of connected devices. The Quark
X1000 is the first in a new line of Intel proces-
sors designed for new applications ranging
from Internet of Things to wearables, trans-
portation, energy, and industrial control.
Altera: power conversion solution for
high-performance FPGAs
Altera announced a new power conversion
solution that makes it easy for board developers
to design point-of-load power solutions and
achieve a high FPGA performance at low sys-
tem power. The solution, a monolithic 40A
driver plus synchronous MOSFET powertrain,
is optimized to meet the core requirements of
Stratix V, Arria 10, and Stratix 10 FPGAs and
SoCs.
Microchip expands digitally-enhanced
power analogue controller portfolio
Microchip announces an expansion of its Dig-
itally Enhanced Power Analogue controller
product line. With the introduction of the
MCP19114 and MCP19115 devices, Mi-
crochip’s diverse range of intelligent DC/DC
power-conversion solutions grows to include
controllers supporting flyback, boost and
SEPIC topologies. These latest devices introduce
a step-up PWM-controller and low-side MOS-
FET driver architecture, with a mid-voltage
LDO and fully-functional microcontroller all
integrated into a small, high-density power
package.
Product News
