n
Kontron: COM eases implementation of
4th gen i7/i5/i3 into individual
application platforms
Kontron has launched the COM Express basic
Computer-on-Module COMe-bHL6 that ac-
celerates and eases the implementation of 4th
generation Intel Core i7/i5/i3 and Celeron
processors into individual application plat-
forms. Up to three independent, daisy-chained
displays with up to 4K resolution are supported
to create stunning user experiences.
n
DAVE: SO-DIMM sized CPU module with
ARM Cortex-A8 processor
Dave launched on the market Diva, the new
CPU module in SO-DIMM form factor based
on the ”Sitara” AM335x microprocessor from
Texas Instruments. Diva is a ARM Cortex-A8
CPU module of the Lite line, and it offers great
computational power and high flexibility, thanks
to the rich set of dedicated co-processors
(NEONMedia Technology, PowerVR SGX 530
3D accelerator, PRU-ICSS subsystem, Crypto
accelerator), in a standard SO-DIMM 204-pin
form factor. Other standing out features are
the extended power supply range [3.6 - 5.5]V,
up to 512 MB of DDR3 SDRAM, on-board
NAND and NOR flash memory, support for
high-resolution displays and industrial specifi-
cation compliance (including the extended op-
erating temperature range from -40 to +85°C).
n
Avalue: low-power Qseven module with
AMD G-series
Avalue Technology is unveiling EQM-A50M
Qseven Module which is powered by the AMD
G-series T40E or T16R CPU with extremely
low power consumption and high graphic
performance. The AMD Embedded G-Series
platform is the world’s first low power CPU
and advanced GPU integrated into a single
embedded Accelerated Processing Unit (APU),
building a new foundation for high perform-
ance multi-media content delivery in a small
form factor and a power efficient platform for
a variety of embedded designs.
n
Advantech: COM Express Basic module with
3rd gen Intel Core processor with PCH
Advantech has presented SOM-9890 — a COM
Express Basic module supporting the latest
3rd generation Intel Core processor (PGA
Type). SOM-9890 offers high performance
and outstanding graphics capabilities, and fea-
turing three independent multiple display
combinations, abundant high speed I/Os and
extensible interfaces up to PCIe x16 Gen 3.
SOM-9890 is an ideal solution for applications
such as medical, gaming, telecom, and digital
signage.
n
MSC: COM Express type 6 modules with
Celeron CPUs
MSC has expanded its high-end MSC C6B-7S
COM Express Type 6 module family. MSC of-
fers C6B-7S modules with three different
Celeron processors and integrated Intel HD
Graphics: The Intel Celeron CPU 1047UE
with 1.4 GHz has two cores and 2 MB cache.
The single-core Intel Celeron 927UE (1.5 GHz)
integrates 1 MB cache. Both processors have a
thermal dissipation power (TDP) of 17 W.
The cost-efficient dual-core Intel Celeron
processor 1020E is clocked with 2.20 GHz and
has 2 MB cache
n
congatec: ARM on Qseven design support
package for Freescale i.MX 6
congatec announces a complete Qseven support
for easy integration of Freescale Semiconductor
i.MX 6 series processors into ARM-based de-
signs. In addition congatec offers a Qseven
Starter Kit, expanded software support with
Adeneo for Windows Embedded Compact 7,
Linux board support package (BSP) plus a
congatec tablet PC demonstrator.
n
Artila: palm size Linux ready box computer
Artila Electronics releases the Matrix-505
ARM9 Linux ready computer, powered by
Atmel AT91SAM9G45 400MHz SoC with
128MB DDR2 SDRAM and 128 NAND Flash.
A fault resilient booting function is imple-
mented by using a backup Linux file system in
the DataFlash which will automatically boot
up Matrix-505 in case the primary NAND
Flash fails. The Matrix-505 integrates two
10/100 Mbps Ethernet, four high speed RS-
232/485 serial ports, two USB hosts and a mi-
croSD socket into a palm size metal box. The
DIN-Rail and wall-mounting capability also
make Matrix-505’s onsite installation flexible.
n
DFI: COM Express Basic Type 6 based on
Mobile Intel QM87 Chipset
DFI launched a Type 6 COM Express Basic
module, the HM960-QM87, in its Mobile Intel
QM87 chipset-based product line that provides
low-power consumption and higher perform-
ance. This new COM Express Basic module
with BGA 1364 packaging technology supports
the 4th generation Intel Core processors built
on 22-nanometer process technology and
boasts a 5~15% CPU performance increase
compared with its previous generations
n
GE: SBCs to feature 4th gen Intel Core i7
technology
GE Intelligent Platforms announced the SBC326
rugged 3U VPX single board computer. Fea-
turing the quad-core 4th generation Intel Core
i7 processor, it will provide outstanding per-
formance per watt while helping to minimize
size, weight and power in deployed subsystems
– making it ideal for constrained environments
such as manned- and unmanned vehicles.
n
F&S: armStone single board computer in
PicoITX form factor
For solutions with Computer on Module
(COM), which need a base board, a Single
Board Computer (SBC) in an established form
factor offers an alternative. The development
of a base board is therefore unnecessary here,
so costs are reduced and development time is
shortened significantly (Time-To-Market). arm-
Stone offers all common interfaces (via standard
bushes or multi-pin connector). A display can
easily be connected via a LVDS interface.
n
Schroff: small industrial subracks for
control cabinets
For small measurement, control and instru-
mentation units that are built into control
cabinets along with a PLC controller, Pentair
has developed a compact Schroff industrial
subrack. This is based on the established eu-
ropacPRO platform of 19“ subracks and is 3
U high, 205 mm deep and just 28 HP wide.
n
DATA MODUL: passive cooled 3.5“ board
with Intel Atom N2600 / N2800 / D2550
With the MS-9896 DATA MODUL introduces
a new, passive cooled 3.5“ embedded board
with Intel Atom N2600 / N2800 / D2550
processors and Intel NM10 Express chipset.
Along VGA and HDMI the MS-9896 has two
independent LVDS interfaces (LVDS1: Single
Channel 18/24 Bit, LVDS2: Dual Channel 24
Bit). The following dual display configurations
are possible CRT+LVDS, CRT+HDMI,
HDMI+LVDS, LVDS1+LVDS2.
9
July 2013
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