Seite 21 - Boards & Solution/ECE Magazine July 2013
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Maxim: highly secure cryptographic
solution
Maxim Integrated Products announced that it
is now sampling the DS28E35 DeepCover Se-
cure Authenticator, a highly secure crypto-
graphic solution for a host controller to au-
thenticate peripherals. The DS28E35 integrates
a FIPS 186-based, Elliptic Curve Digital Sig-
nature Algorithm (ECDSA) engine to imple-
ment asymmetric (public-key) cryptography
to operate a challenge-and-response authenti-
cation protocol between a host controller and
attached peripherals, sensors, or modules. Op-
erating over a single pin on the 1-Wire® inter-
face, the DS28E35 reduces interconnect com-
plexity, simplifies designs, and reduces cost. It
provides crypto-strong authentication security
for many applications, including medical sen-
sors, industrial programmable logic controller
(PLC) modules, and consumer devices.
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A.R. Bayer DSP Systeme: new Bittware
distributor for Europe
BittWare has added A.R. Bayer DSP Systeme
as a new sales channel partner. A.R. Bayer
DSP Systeme focuses on hardware, algorithms
and tools for digital signal processing; they
now sell and support BittWare products in
Germany, Benelux, Switzerland, and other cen-
tral European countries including Austria, Slo-
vakia, Czech Republic and Poland.
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IBASE: OPS compliant signage player
powered by Core i7/i5/i3
IBASE announces the iOPS-76, an Open Plug-
gable Specification compliant signage player
powered by the new mobile 3rd Generation
Intel Core i7/i5/i3 and Celeron Quad -
Core/Dual-Core processors together with the
mobile Intel QM77 Express chipset. The Open
Pluggable Specification effectively lowers de-
ployment and field maintenance costs to sim-
plify device installation, maintenance, and up-
grades and allows digital signage manufacturers
to deploy systems faster, with lower costs for
development and implementation.
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Microchip: low-power, general-purpose
op amps
Microchip announces a new nine-member
low-power, general-purpose operational
amplifier
(op
amp)
family—the
MCP647X/8X/9X. These op amps provide
among the industry’s best power consumption
for a given gain-bandwidth product, including
low quiescent current, to extend battery life-
times. Additionally, they have exceptionally
low leakage current over temperature, up to
125°C, which reduces errors in applications
such as sensor conditioning.
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ams: power management IC helps reduce
thermal stress on processors
ams introduced the AS3721, a power manage-
ment IC with an innovative remote-feedback
circuit that helps reduce the thermal stress of
applications processors in smartphones and
tablets. When paired with new AS3729 point-
of-load regulators from ams, the highly-inte-
grated AS3721 provides a complete power
management system that offers a fast response
to load transients for reliable processor per-
formance, high efficiency, and flexible board
layout. The AS3721 and AS3729 are optimized
for use with Tegra applications processors
from Nvidia.
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Vecow: 4 port GbE PoE+ card with
PCIe lane
Vecow announces the 4 port Gigabit Ethernet
PoE+ card PE-1004, which supports IEEE
802.3at compliant power sourcing equipment
devices and supply 25.5 watts at 48 VDC on
each port. Using one single cable to sync data
and transfer power in a simple and cost ef-
fective method.PE-1004 provides 9kb jumbo
frame and link aggregation for higher platform
performance and speedy data transition. Using
universal PCI-express by 4 lane interface, PE-
1004 is easy to work with any fan-less indus-
trial computers. PE-1004 is ideal for IP video
surveillance, automation optical inspection,
industrial automation, intelligent transporta-
tion system, and other industrial application
fields.
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Telit: GSM/GPRS dual-band 900/1800
module in Elster EnergyICT’s
communication module
Telit Wireless Solutions announced that the
company’s GL865-DUAL, smallest GSM/GPRS
dual-band 900/1800 wireless module in LCC-
castellation packaging is to become the cellular
M2M technology integrated into Elster Ener-
gyICT’s AM110-R Communication Module.
The AM110-R provides wireless wide-area
network connectivity for Elster’s AS300 Smart
electricity meter.
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Distec provides optical bonding in
new Vacuum technology
Distec now provides optical bonding in new
vacuum technology. In this process a protective
glass, a touch screen or both are bonded using
a high quality optical material onto a TFT dis-
play. The result is a display that is rich in con-
trast, offers exceptional readability, and is well
suited for use in direct sunlight. This cutting
edge vacuum technology has clear advantages
compared to the ‘wet bonding’ technology
currently employed worldwide.
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Infineon: fully certified FlexRay transceiver
for in-vehicle communication
Infineon Technologies is expanding its portfolio
of LIN and CAN automotive communications
ICs with its first FlexRay™ transceiver. The
new TLE9221SX is fully compliant to the most
current FlexRay Electrical Physical Layer Spec-
ification version 3.0.1. It enables very high
data rates of up to 10Mbit/s for in-vehicle
communication and features best-in-class ESD
rating of +/-10kV. As an interface between the
communication controller unit and bus wires,
the TLE9221SX transceiver was developed for
use in suspension and chassis control applica-
tions as well as for power steering, engine and
transmission control units.
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Eurotech to simplify device management
in the Internet of Things
Eurotech launched Everyware Cloud 3.0 plat-
form with remote device management to de-
liver actionable data from the field to down-
stream applications and business processes,
dashboards, and reports. Everyware Cloud
3.0 can connect sensors, devices or assets
quickly to analyze data in real-time for reliable,
device-independent M2M applications. New
features allow companies to remotely create
new services and functionalities on field de-
vices, allowing them to develop and launch
innovative product and revenue streams.
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AAEON: products based on 4th Generation
Intel Core processors
AAEON announced a new series of high per-
formance, scalable and optimized low-power
embedded products: COM-QM87, IMBA-
Q87A, EMB-QM87A, GENE-QM87 and
FWS-7810. Designed based on the 4th gener-
ation Intel® Core™ processor family together
with the Mobile Intel® QM87 Express or
Intel® Q87 Express chipsets, these products
offer full-function availability, enhanced
graphic performance and high affordability
for customers to expedite graphic-intensive
works.
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CES: highly customizable Kintex-7 FPGA
processor board
Creative Electronic Systems announces the
FIOV-2310, a 3U OpenVPX module with a
Xilinx Kintex-7 325T/410T user-programmable
FPGA at its core. The FIOV-2310 allows the
flexible configuration of the high-speed links
between the FMC connector and various VPX
backplane profiles making it suitable for the
most demanding and complex applications.
The Kintex-7 FPGA makes it possible to pro-
gram the backplane interconnect to any of the
popular serial fabric protocols.
21
July 2013
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