ECE + BAS February 2014 - page 38

February 2014
36
E
XHIBITION
H
IGHLIGHTS
Hall-Stand 1-511
DFI: COM Express basic module powered
by 4th gen Intel Core processors
DFI launches a new COM Express basic mod-
ule, the HM920-QM87 with BGA 1364 pack-
aging technology for the latest 4th generation
Intel Core processor family. The HM920-
QM87 is built on 22-nanometer process tech-
nology offering higher processing perform-
ance, superior graphics display support, and
evolutionary improvements in systemmemory
and I/O interfaces. It is DFI’s new COM Ex-
press product that supports the mobile-based
Intel QM87 Express chipset boasting a 5~15%
CPU performance increase over the previous
generations.
Hall-Stand 1-520
Swissbit: storage solutions for all industrial
applications at embedded world
At embedded world, Swissbit will be pre-
senting the S-40 and S-40u series, i.e. the
first SD and MICRO SD memory cards with
autonomous data maintenance that require
no intervention by host or application. This
enables the memory cards to offer much
longer data retention than conventional SD
or MICRO SD cards. Another highlight will
be the recently launched X-55 series.
Compared to standard MLC SSDs, Swissbit's
EM-MLC 2.5'' SATA SSD drives achieve en-
durance values up to ten times higher while
maintaining consistent data retention, in line
with the JEDEC standard. The sophisticated
diagnosis and monitoring features as well as
deletion technology such as Secure Erase
make the X-55 series ideal for cost-sensitive
industrial applications that nevertheless have
tough requirements.
Hall-Stand 1-310
Rutronik presents portfolio of embedded
boards at embedded world
Rutronik Elektronische Bauelemente is pre-
senting its portfolio of embedded computing
boards, displays, memory components, auto
ID, wireless modules and intelligent sensors
with maximum depth of integration for the
embedded systems of the future at embedded
world 2014. For this reason, Rutronik is today
responding to the requirements for the future
project Industrie 4.0 and the integrated ap-
proach for all networked applications.
At its trade fairs stands, Rutronik is exhibiting
the technological foundation for the Internet
of Things and Services in all functional and
practical details. These include a comprehen-
sive portfolio of RISC-based board solutions
with module solutions as well as single-board
computers from various manufacturers. High-
lights of the x86 segment are the industrial
AMD embedded G-series 'eKabini', Intel's
new Atom platform 'Bay Trail' and the 4th
generation Intel Core i technology. In the
storage area, Rutronik is exhibiting the new
EM-MLC (Endurance Managed - Multi Level
Cell) SD, microSD and SSD Flash memory
cards, some with Lifetime monitoring tools,
as well as MLC SSDs for the expanded tem-
perature range. Rutronik is introducing TFT
displays with integrated projected-capacitive
and resistive touchscreen technology as well
as without touchscreens in sizes up to 19"
from its new franchise partner DLC Display.
It will also exhibit TFT displays with integrated
projected-capacitive touch f
rom NLT Technologies. In the Wireless seg-
ment, and as the sole distribution partner in
Europe, Rutronik is displaying the complete
certified development tool RFduino with in-
tegrated antenna. It can be operated with Ar-
duino firmware as well as with software from
Nordic Semiconductor. An interested developer
has supplied the distributor with a few hun-
dred discovery kits for the M24SR64 dual in-
terface EEPROM from STMicroelectronics
with short range RFID standard. Experienced
product and application engineers will be
available to provide fair visitors with expert
advice.
Hall-Stand 4-548
Toshiba shows “Digital Kiosk”
at Embedded World 2014
At Embedded World 2014, Toshiba Electronics
Europe will be showcasing technologies from
across its wide range of standard and custom
semiconductor solutions. Among the featured
demonstrations is a “Digital Kiosk” that com-
bines TransferJet, NFC and Qi wireless charging
technology to show an example use case in
which rich digital content, including HD video,
can be purchased and downloaded swiftly to
mobile devices, such as smartphones. Other
sections of the stand will highlight solutions
that help to accelerate application development
in areas including automotive, industrial, mul-
timedia, telecoms, smart communities, net-
working, home appliances and consumer de-
vices.
Toshiba’s Digital Kiosk is a fully finished con-
cept system that shows how various emerging
wireless technologies can function together
to deliver new services. The single formed
plastic unit comprises an LCD screen with
platter for smartphone charging or wireless
connection, and status LEDs. To operate, the
user taps a kiosk app icon on their smartphone,
previews the available video content via the
Kiosk screen, and, if decides to buy, presses
the Purchase button and places the smart-
phone on the kiosk’s platter.
The NFC authentication and payment process
will then initiate and, once complete, content
will be downloaded via TransferJet to the
phone with up to 560Mpbs. The phones are
equipped with Toshiba uUSB TransferJet don-
gles. Users also have the option to recharge
the phone handset wirelessly on the platter.
Other sections of Toshiba’s stand focus on
NAND-based storage technology including
SD cards, USB flash drives, embedded NAND,
SSD and HDD; automotive solutions for
ADAS and instrument cluster; and micro-
controllers - including high-performance,
low-power ARM-based MCUs. In addition
to the Digital Kiosk, wireless products will
include Toshiba’s latest Bluetooth 4.0 devices,
together with starter kit. Mobile peripheral
devices, CMOS sensors for industrial appli-
cations, and the AppLite application processor
will also be featured.
Hall-Stand 1-511
DFI: COM Express Compact module with
AMD Embedded G-series SoC
DFI launches the KB968, a new Type 6 COM
Express Compact module in its product line
based on the AMD Embedded G-Series Sys-
tem-on-Chip. This is DFI’s first Compact mod-
ule powered by AMD Embedded G-Series SoC
which is delivering up to 70% overall im-
provement over AMD G-Series APU.
This new module with the latest AMD em-
bedded G-Series processor-based SoC platform
that features power efficiency, high perform-
ance, and enhanced multimedia capabilities is
well-suited for intelligent systems that display
videos, graphics and interactive content such
as gaming machines.
Hall-Stand 1-606
PEAK-System: CAN to WLAN gateways
in plastic housing with a flange
PEAK-System complements its new gateway
product family by two other WLAN-enabled
devices. The PCAN Wireless Gateways facili-
tate the connection of CAN busses over
WLAN. For this, CAN frames are wrapped in
TCP or UDP message packages and forwarded
from one device to another over the IP net-
work. Configuration of the devices is provided
by a convenient web interface.
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