October 2014
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Microsemi: updated Libero SoC v11.4
software improves design flow runtime
Microsemi announced the release of its updated
Libero System-on-Chip version 11.4 compre-
hensive design software used for the develop-
ment of the latest generation of Microsemi’s
FPGA SoC products. The Libero SoC v11.4
release improves design flow runtime by up to
35 percent for its award-winning SmartFusion2
SoC FPGAs and IGLOO2 FPGAs.
IDT: 1.5V PCI Express clock buffers
Integrated Device Technology announced the
expansion of its PCIe timing portfolio with the
industry’s first 1.5 V PCI Express buffer family.
IDT’s new U-series ultra-low power PCIe buf-
fers operate from the same supply voltage as
modern systems-on-chip and field program-
mable gate arrays, enabling designers to use the
same power rail, thus reducing system com-
plexity, physical size, and power consumption.
Apacer launches DDR4 2133 U-DIMM
To adapt to the changing market trends, Apacer
newly launches the DDR4 2133 4GB/8GB
Unbuffered DIMM, which combines the
advantages of both high speed and low power
consumption. Compared to its predecessor, its
work clock rate is 2,133 Mbps with the trans-
mission bandwidth boosted up to 17GB/s,
delivering a 14% improvement in performance.
Trinamic: dual-axis stepper
motor controller/driver SoC
TRINAMIC Motion Control announced the
TMC5062 monolithic dual-axis motor con-
troller and driver that incorporating eight of
Trinamic’s patented or patent-pending motion
control technologies. This new SoC integrates
dcStep, Trinamic’s proprietary technology
for automatically adapting motor velocity for
sudden increases in load.
Yamaichi: quad SFF pluggable
plus connector for 40/100GbE
Ethernet and InfiniBand
Yamaichi Electronics releases their eQSFP+
product series as the solution for next gener-
ation 40GbE/100GbE Ethernet applications.
With the recent increasing demand for a faster
and more reliable form factor signal transmis-
sion interface, Yamaichi presents high-speed
32Gbps enhanced Quad Small Form-factor
Pluggable plus (eQSFP+) host connectors.
RUTRONIK: coordinated portfolio
for devices on Internet of Things
With RUTRONIK SMART, Rutronik now
launches a new range of bundled hardware,
software and services. RUTRONIK SMART
brings together entire solutions, consisting
of selected sensors, wireless components,
micro-controllers, power management and
safety solutions for devices on the Internet
of Things. While RUTRONIK EMBEDDED
supplies industrial customers with embedded
boards, storage, displays, wireless modules,
auto-ID components and specific periph-
eral components, with RUTRONIK SMART
Rutronik is providing specific support to man-
ufacturers of devices on the Internet of Things.
Toshiba: motor driver ICs save
space and simplify design
Toshiba Electronics Europe has introduced
two new motor driver ICs, TC78H610FNG
and TB67Z800FTG, which save space and
simplify design in low power motor applica-
tions. TC78H610FNG is anHbridge driver for
low voltage brushed DC motors, such as those
used in home appliances and battery-pow-
ered equipment. Supplied in a SSOP16 pack-
age, it can reduce the required mounting area
by 21% compared to conventional products
with similar functionality housed in SSOP20
packages. This allows reduction in the size of
equipment and the cost of the PCB.
Innodisk: high performance
industrial SSDs
Innodisk announces a new series of high
performance industrial SSDs. Available in
standard 2.5“ SATA III as well as SATA Slim
formats, the 3MG2-P series uses a custom
new ID201 controller, synchronous NAND
flash and 19nm manufacturing process to
produce high sequential speeds and random
IOPS, while preserving industrial level reli-
ability, power protection, and ruggedness.
Fujitsu Semi and ON Semi
announce strategic partnership
Fujitsu Semiconductor and ON Semicon-
ductor have entered into a foundry services
agreement. Under the terms of this agree-
ment, Fujitsu will manufacture wafers for ON
Semiconductor at its 8-inch front-end semi-
conductor wafer fabrication facility located in
Aizu-Wakamatsu, Japan.
Microsemi: low jitter and small
size clock management devices
Microsemi announced its new ZL30250 and
ZL30251 flexible clock generators. The devices
are an ultra-low jitter solution (160fs [12kHz-
20MHz integration band]) in a 5x5mm
package capable of replacing multiple high
performance crystals and crystal oscillators,
thus lowering bill of material cost along with
easing design and testing of timing solutions.
FTDI: collaboration with MCCI for
advanced embedded SoC products
FTDI Chip announces that its technol-
ogy partnership with MCCI Corporation,
developer of USB drivers and firmware for
embedded SoC, has resulted in the avail-
ability of TrueTask USB - an embedded USB
host stack designed for use with FTDI Chip’s
ground-breaking FT900 product family.
Mouser now stocking Cypress
CY7C1049CV33 fast Async SRAM
Mouser Electronics is now stocking the
CY7C1049CV33 Fast Async SRAM from
Cypress Semiconductor. Engineered using
Cypress‘s high-performance Complementary
Metal Oxide Semiconductor technology, this
4 Mbit, static RAM device is organized as
524,288 words by 8 bits, provides a high-speed,
maximum access time of 8 ns and offers easy
memory expansion with CE and OE features.
Softing: replacement for Yamaha’s
discontinued FIND1+ chip
Softing‘s UFC100-L1 (Unified Fieldbus Con-
troller) is a fully pin-compatible alternative
to the discontinued fieldbus ASIC Find1+
(YTZ420-VZ) from Yamaha. Conformance,
interoperability, and physical layer tests were
performed to verify that the UFC100-L1 is
a direct replacement for the YTZ420 ASIC.
Softing‘s UFC100-L1 demonstrates addi-
tional advantages including, improved
jitter tolerance/robustness, lower power
consumption, and a larger FIFO memory –
resulting in fewer interruptions to the field
device processor.
AAEON: network appliances
system with Intel Atom E3800
The newest release FWS-2250 is compact, fan-
less network appliance that boosts the perfor-
mance yet offering low power consumption
network appliance system. System is based
on the new Intel Atom E3800 series CPU and
support four Gigabit Ethernet ports. A highly
integrated compact system supporting two
SoDIMM’s, one Compact Flash socket, two
USB2.0 ports (with optional one USB3.0 port),
one console port (via additional RJ45 port).
EKF: XMC module with quad
port Gigabit Ethernet NIC
EKF introduces the DN1-PIKE, a mezzanine
card for XMC module carrier, equipped with
four individual Gbps Ethernet controllers. All
ports are available via RJ45 front bezel jacks.
The Intel I211 (option I210-IT) Ethernet NICs
provide latest networking technology, e.g.
power management for increased efficiency.
