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omputer
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tors considered here, which also makes the
module somewhat more robust than the
Qseven despite its very thin PC-board. The
314 pins of the module plug connector offer
more signals overall than on the Qseven.
Additional signals are available for graphics
and MIPI-CSI to permit broader utilization
of the capabilities of the new generation Intel
Atom processors. Overall, the defined pin-
out is more advanced and aligned to future
needs than that of the Qseven, and this can
be of benefit to special new designs. When
the SMARC module is operated with 5V sup-
ply voltage, the full performance range of the
new Intel Atom processors can be covered.
In this case, the potential limitations in the
upper performance segment that occur in the
Qseven do not apply.
The COM Express Mini module, which also
has a very compact form factor (84mm x
55mm), primarily impresses with its very
rugged construction with regard to mechan-
ical design, plug connectors, PC-board and
cooling connection. Consequently, the COM
Express Mini offers ideal support for the new
‘Apollo Lake -I’ processors that are designed for
tough environmental conditions in embed-
ded and industrial applications. The 220-pin
module plug connector also provides a large
share of its interfaces for the carrier board.
However, as was the case for the Qseven, there
are limitations with regard to MIPI-CSI, USB
3.0 and third-party graphic interfaces. Since
the pinout only offers single-channel LVDS
(or alternatively eDP), there are also limita-
tions in connecting high-resolution internal
displays. It may be necessary to provide an
eDP bridge on the carrier board that generates
dual-channel LVDS. Some module manufac-
turers have responded to this need and have
prioritized variants populated with eDP pin-
outs. The COM Express Mini offers sufficient
reserves for all Intel Atom derivatives with up
to 28W of reliable power consumption.
Users whose focus is on rugged and reliable
Intel Atom designs with a lot of functional
range and full performance capability will
find that the COM Express Compact is a very
good choice. Although its dimensions are
larger at 95mm x 95mm, there is still enough
available space to offer memory versions with
fully equipped 8GB dual-channel DDR3L
memory and an ECC option (automatic error
correction). This is an important aspect for
fully exploiting the computing and graphic
performance of the new Intel Atom pro-
cessors. Depending on the application area,
there are module variants with two DDR3L
SO-DIMM sockets (high flexibility in system
configuration, but without ECC) or with sol-
dered ROM (with ECC and high reliability
under shock, vibration and harsh environ-
mental conditions).
The COM Express Compact offers two plug
connectors, each with 200 pins, so that nearly
all interfaces of the new Intel Atom processors
are available on the carrier board. This means
that all three of the processor graphic outputs
can be used with full performance capability
and resolution. All three USB 3.0 interfaces
are available as well. These signals are only
lacking when MIPI-CSI cameras are used.
Since application areas for the new Intel Atom
processors are so wide-ranging, all of the
embedded module standards discussed here
can demonstrate justification for their exis-
tence. In new, very compact designs, especially
in the area of mobile applications, SMARC
appears to be overtaking the Qseven form fac-
tor over the mid-term. Under harsh duty con-
ditions, the COM Express is usually preferred.
The Mini version is impressive here based
on its small dimensions. Users who wish to
exploit the entire performance range of the
new Intel Atom processors for industrial
applications generally find the COM Express
Compact to be the best choice.
n
Categorization of the latest Intel Atom E3900, Celeron N and Pentium N processors which Intel
is offering for the embedded market with long-term availability.
