November 17
20
C
omputer
-
on
-m
odules
COM modules designed for industrial
applications from edge to cloud
By Norbert Hauser,
Kontron
This article explains
the requirements digitalization will
bring to the manufacturing industry,
and how powerful COM Express
modules can help to meet
the demands for the embedded
high-performance computing
(eHPC) that is needed.
n
Manufacturing companies around the
globe are faced with digital transformation of
their production lines. Automation and smart
manufacturing concepts erase the barrier
between enterprise systems such as ERP, CRM,
and order processing and process control. To
benefit from the added efficiency, reduced cost
and new business models inherent in the dig-
ital transformation of manufacturing, enter-
prises have to adapt their systems to serve
in production environments. Edge, fog and
cloud applications demand enhanced com-
puting power. Traditional server approaches
cannot provide the required robustness for
operation in harsh industrial environments.
Modular systems based on the well-estab-
lished and tested COM Express modules
provide an efficient solution. Type 7 is a new
variant which for the first time ever meets the
demands for embedded high-performance
computing (eHPC).
In contrast to most business and IT applica-
tions, many production tasks cannot be easily
outsourced to a cloud, although it would be
useful in terms of simplification, cost saving,
and maintenance. In spite of modern infra-
structures such as TSN-based networks, the
physical length of the lines with the associ-
ated latencies means real-time control out of
the cloud is out of the question. Also, many
companies do not want to see their entire pro-
duction data and know-how to be stored and
processed off-premise. Edge and fog comput-
ing can provide a solution to this conundrum.
This means moving the cloud physically closer
to production or consolidating data by on-site
pre-processing. Of course, there are robust,
industry-grade edge gateways available. Their
performance, however, is limited. In many
scenarios, it is more cost-efficient and ser-
vice-friendly to maintain ample computing
power directly on site. A key enabler for cost-ef-
ficiency can be wide scalability, highest avail-
ability, and reliability – three qualities which
are generally required in industrial applica-
tions. These features have also been long asso-
ciated with standardized computer modules
(COMs). So, what could be better than to base
an on-premise, scalable computing infrastruc-
ture on proven module systems? This design
would be scaled for today’s demands, with the
option of easy upgrading later.
One of the main advantages of the use of
COMs is the largely pre-integrated platform.
Customers can fully concentrate on the devel-
opment of their own applications. This is
where the know-how for the respective solu-
tion and also the actual core competency and
the added value of their companies are based.
Ideally, the module supplier offers a carrier
board containing all required interfaces. If,
however, special functionality (in the indus-
trial field, this usually means special fieldbus
interfaces) is missing, using the module sup-
plier know-how of existing solutions (IP) and
resources will save time, resources, and trouble.
This applies in particular to elements which
require specific knowledge and experience,
most importantly safety and security. Proven,
standardized, cross-platform concepts that
reduce time-to-market costs through syn-
ergy effects are ideal. A perfect manufacturer
should have extensive experience in the pro-
duction of standardized modules and a broad
portfolio of customer references based on the
specific application. Under current embed-
ded module standards, the highest scalability
with regard to maximum power dissipation
(and thus indirectly also maximum computing
power) is offered by the PICMG COM Express
standard. For instance, its Basic form factor,
measuring just 95 x 125mm, can easily use
processors with a TDP (thermal design power)
of 50 watts and more. The rapidly growing
demand for high computing and network per-
formance in the modular and embedded mar-
ket has also led to the PICMG redefining the
COM Express standard, based on the COM
Express Standard Type 6, which dominates
the current embedded market. Partially reor-
ganizing the connector signals, it has dropped
graphic signals altogether and replaced themby
four 10 GBit interfaces to support faster exter-
nal Ethernet connections. In addition, eight
