15
November 2015
B
oards
& M
odules
u-blox manufactures and supplies
Cohda Wireless pioneer V2X module
u-blox announced a further cooperation with
Cohda Wireless. To meet rapidly increasing
demand for V2X modules for trials, early
deployments and infrastructure roll-out,
Cohda Wireless and u-blox have agreed on an
exclusive license for the use of the latest MK5
module design, leveraging u-blox strengths
in quality manufacture and global supply of
automotive components for positioning and
communications.
Rutronik: new efus from F&S based on
i.MX 6UltraLite ARM Cortex-A7 processor
The new efus A7UL from F&S is based on the
Freescale i.MX 6UltraLite ARM Cortex-A7
processor. The efus form factor is designed
according to “EasyLayout” guidelines. There-
fore, the module is perfectly suited for appli-
cations with numerous interfaces in medicine
and industry. The efus A7UL is available at
distributor Rutronik as of now.
Pentair: new design tools for
Calmark Card Lok and Birtcher
Wedge Lok products
Pentair announces its extended partnership
with Traceparts to offer new design tools
to support Calmark Card Lok and Birtcher
Wedge Lok printed circuit board retention
and conduction cooling products. These
new tools include a part number configura-
tor, which helps customers identify the cor-
rect Card or Wedge Lok part number for their
application, and on-demand 2D and 3D CAD
downloads.
SGET prepares launch of
new IoT workgroup
Within the SGET Standardization Group for
Embedded Technologies a new workgroup is
about to be established. The SDT.04 (Standard
Development Team) workgroup will develop
standards for the interaction of embedded
computing systems within the Internet of
Things, which is currently gaining momen-
tum in the market.
N.A.T.: DSP-based media acceleration
engine as a plug-in AMC board
N.A.T. announced the NAMC-ODSP, a pow-
erful new AdvancedMC module that enables
telecom equipment and service providers
to add video and audio acceleration to their
AdvancedTCA and MicroTCA systems. The
NAMC-ODSP combines a powerful Xilinx
Kintex-7 FPGA with an array of up to eight
Octasic OCT2224M DSPs, an on-board
switch and advanced media gateway software.
Round Solutions: GSM/UMTS/HSPA+
module with easy plug and play options
The R-UC864 module, designed by Round
Solutions, allows the user easy plug and play
options for UMTS/HSPA, CDMA and LTE.
With plug and play options via the Telit Global
Form Factor, the entire range of Telit xE910
modules are supported and optional features
such as voice and GPS can easily be fulfilled
without the need for re-work or re-design.
MSC: COM Express starterkit for modules
with BayTrail and Braswell processors
MSC presents the COMExpress Starterkit MSC
C6-SK-BT-EV-KIT001 for Type 6 modules
based on the Intel Atom E3800 and related Cele-
ron processors as well as modules equipped with
the new Intel Celeron and Pentium N3000 pro-
cessors. The Starterkit features the new COM
Express Type 6 carrier board in the Mini-ITX
form factor, two SO-DIMM memory modules,
heat sink and suitable power supply.
AAEON: optimize vehicular applications
with latest 3.5” subcompact board
To further satisfy the increasing demand for
in-vehicle computing capabilities, AAEON
launches the latest 3.5” Subcompact Board:
GENE-BT06. Being the newest entry into
the company’s family of subcompact boards,
the focus of this new iteration has shifted
from general industrial usage to applications
in high shock/ high vibration environments,
such as onboard vehicles and inside lifts. A
series of specific design features have also
been added to complement this shift.
HEITEC: RiCase family now available as
modular enclosure technology on rolls
HEITEC expands its RiCase housing range
upon customers’ request with enclosures for
flexible, modular use and heavy loads. This
line, suitable for 19 inch rack-mount as well
as for the mounting of components, is meet-
ing many market requirements for ultra-sta-
ble table-top and system enclosures.
congatec presents first µQseven
computer modules
congatec is extending its product portfolio for
the most popular Qseven standard by now
offering Computer-on-Modules in the 40 x
70 mm sub-credit-card µQseven format. The
first flagship module of this next generation
mini form factor is the conga-UMX6 with
ARM Cortex A9-based Freescale i.MX 6 pro-
cessors. It caters to applications in harsh envi-
ronments, which require not only compact
low-power designs, but also appealing multi-
media and computing performance.
