ECE/BAS Magazine June 2015 - page 44

June 2015
44
P
RODUCT
N
EWS
„n
Wind River: Linux profiles updated
with latest kernel/ toolchain from
Yocto Project 1.7 release
Wind River has delivered enhancements to
Wind River Open Virtualization, Security
Pro le for Wind River Linux, and Carrier
Grade Pro le for Wind River Linux.
ese
pro les provide developers with key capa-
bilities to create the safe, secure, and reliable
intelligent systems that will harness the power
of the Internet of ings. Open Virtualization,
Security Pro le, and Carrier Grade Pro le
have been updated with the latest Linux ker-
nel, toolchain, and user space from the Yocto
Project 1.7 release.
„n
SYSGO and Curtiss-Wright present
safety-critical Avionics platform
At the Aviation Electronics Europe event,
SYSGO and Curtiss-Wright Defense Solutions
will demonstrate a joint platform for avionics
systems that combines SYSGO’s DO-178B/C
certi ed hypervisor PikeOS with Cur-
tiss-Wright’s VPX3-1701 Freescale LS1020A
dual ARM Cortex-A7 processor-based sin-
gle board computer.
e demo will feature
CoreAVI safety-critical OpenGL ES/SC graph-
ics drivers running on Curtiss-Wright’s XMC-
715 E4690 GPU-based graphics module. At
SYSGO’s booth, visitors can learn about the
new safety-tested platform.
„n
iSYSTEM : embedded Multi-Core
conference in Munich
e consortium EMCC2015 consisting of the
partner companies Elektrobit, In neon, iSYS-
TEM and Timing-Architects, do hold an
Embedded Multi-core conference June 16th to
18th 2015 in Munich, Germany. With the focus
on “Best Practice Multi-Core Embedded Devel-
opment and Test“, the four partner companies
will bring together multi-core experts to meet
the challenges of this technology and to present,
discuss and exchange experiences and solutions.
„n
Microchip: 5 GHz power amplifier module
for IEEE 802.11ac Wi-Fi standard
Microchip announces its new SST11CP22 5
GHz Power Ampli er Module for the IEEE
802.11ac ultra-high data-rate Wi-Fi stan-
dard.
is PAM delivers 19 dBm linear out-
put power at 1.8% dynamic Error Vector
Magnitude with MCS9 80 MHz bandwidth
modulation. Additionally, the SST11CP22
delivers 20 dBm linear power at 3% EVM
for 802.11a/n applications, is spectrum mask
compliant up to 24 dBm for 802.11a commu-
nication, and has less than -45 dBm/MHz RF
harmonic output at this output power, mak-
ing it easier for the system board to meet
FCC regulations.
„n
Renesas: development environment
for RL78 family
Renesas Electronics announced the avail-
ability of the CC-RL C compiler, a develop-
ment environment for the RL78 Family 16-bit
MCUs widely used in the home appliances,
industrial, and automotive systems. Recently,
increased diversity and performance of func-
tions provided by systems that include motors,
such as home appliances or industrial equip-
ment, have become strongly desired. is has
resulted in demand for increased processing
speed in the MCUs used.
„n
Vector introduces Covered by Analysis
capability in VectorCAST 6.3 suite
Vector So ware announces the availability
of VectorCAST/CBA (Covered By Analysis)
which allows users in regulated industries
to augment measured coverage with manual
analysis to achieve the mandated 100% code
coverage. VectorCAST/CBA is available as an
add-on for all VectorCAST products, and pro-
vides an intuitive editor which allows users to
provide analysis for statements, branch out-
comes, or MC/DC pairs depending on the
coverage level.
„n
Atmel: lowest power ARM Cortex-M
based solution extends battery life
Atmel is sampling the industry’s lowest power
ARM Cortex-M based solution with power
consumption down to 35µA/MHz in active
mode and 200nA in sleep mode.
e ultra-
low power SAM L family broadens the Atmel
| SMART 32-bit ARM-based MCU portfolio
and extends battery life from years to decades,
reducing the number of times batteries need
to be changed in devices such as re alarms,
healthcare, medical, wearable, and devices
placed in rural, agriculture, o shore and other
remote areas.
„n
Cadence and ARM announce strategic
IP interoperability agreement
Cadence Design Systems and ARM announce
the signing of a broad Intellectual Property
Interoperability Agreement.
is multiyear
agreement provides reciprocal access to relevant
IP portfolios from the Cadence IP Group and
ARM. Additionally, the agreement grants both
companies rights to manufacture test chips con-
taining Cadence IP and ARM IP and to provide
development platforms to customers.
„n
TI introduces ultra-low-power
32-bit MSP432 MCUs
TI’s newMSP432 MCUs are the latest advance-
ment in the company’s ultra-low-power inno-
vation, delivering a best-in-class ULPBench
score of 167.4 – outperforming all other Cor-
tex-M3 and -M4F MCUs on the market. is
ultra-low power benchmark from the Embed-
ded Microprocessor Benchmark Consortium
(EEMBC) provides a standard way to com-
pare power performance on any MCU, inde-
pendent of architecture.
„n
Toshiba: ARM Cortex-M4F-based MCUs
for secure communications control
Toshiba Electronics Europe has announced a new
ARM Cortex-M4F based microcontroller for use
in secure systems control. e TMPM46BF10FG
expands Toshiba’s existing TX04 range and adds
a selection of enhanced security features, ide-
ally suited to applications in Internet of
ings
devices, energy management systems, sensor
technology and industrial equipment.
„n
Mouser: keep memory safe with
gamma-resistant Wire EEPROM
Mouser Electronics is now stocking the
DS28E80 1 Wire Gamma Resistant EEPROM
from Maxim Integrated.
e DS28E80
includes 248Bytes of non volatile memory
that utilizes a storage cell technology resistant
to up to 75 kiloGray of gamma radiation. e
Maxim Integrated DS28E80 1 Wire EEPROM,
available from Mouser Electronics, has 248
bytes of non-volatile memory organized in
31 blocks of 8 bytes each. Individual blocks
can be write-protected to prevent accidental
erasure of data. For additional security, each
memory block can only be written eight times.
„n
Telit: GNSS module enables
high-performance position reporting
and navigation solutions
Telit Wireless Solutions released a new GNSS
module, the SE868-V3.
is positioning
module combines GPS, Glonass, Beidou, Gal-
ileo, and SBAS which enables the creation of
high-performance position reporting and
navigation solutions.
e SE868-V3 can nav-
igate to -162 dBm and track to -166 dBm,
thereby providing improved performance in
harsh environments. It is pin-to-pin compat-
ible with the former SE868-V2 as well as the
JF2.
is advanced GNSS module can track
GPS and Glonass or GPS and Beidou constel-
lations simultaneously and it is Galileo ready.
„n
MSC: high power LEDs from
Cree reduce system costs
MSC Technologies is o ering the new XLamp
Extreme High Power (XHP) LEDs from Cree
. e rst LEDs powered by Cree’s revolution-
ary SC5 Technology Platform, XLamp XHP50
and XHP70 LEDs provide twice the lumen
output and improved reliability compared to
previous LEDs of the same size.
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