April 2015
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congatec extends availability of AMD
processor-based COMs to ten years
congatec has extended the long-term avail-
ability of its AMD processor-based Com-
puter-on-Modules from seven to ten years,
securing the supply of Qseven, COM Express,
XTX and ETXmodules with AMD Embedded
G-Series SoC in identical con guration for an
additional three years. For the AMD Embed-
ded G-Series SoC processors this means an
extension into the rst quarter of 2024.
Kontron presents new IoT capable
member of the KBox family
Kontron introduced the latest member of the
KBox series at embedded world, the KBox
A-103. e design of the embedded box PC is
very compact and, due to the powerful hard-
ware, ideal for use in factory automation sys-
tems. e robust construction also means it is
also suitable for use in the harshest industrial
environments.
SILICA: expanded 3G and 4G cellular
M2M communications portfolio
SILICA has announced a franchise agreement
with Huawei. Under the agreement, SILICA
is marketing multi-standard 3G and 4G wire-
less modules in a choice of popular form fac-
tors, including LGA, PCIe and PCI-SIG M.2.
Based on HUAWEI HiSilicon chipset tech-
nology, the new modules o er features spe-
ci c for M2M communication. As a leading
distributor, SILICA provides in-depth techni-
cal support and is providing so ware support
out of the box for HUAWEI modules for their
ArchiTech evaluation boards, accelerating and
facilitating the product development.
Concurrent: CompactPCI processor
board with 10 Gigabit Ethernet
Concurrent Technologies has introduced a
new 6U CompactPCI board based on a 4th
generation Intel Core or Celeron processor
with the option of 10 Gigabit Ethernet inter-
faces. PP B1x/msd is a single slot air-cooled
board, allowing customers to easily migrate
to the latest generation of Intel processors for
longer system life-cycles. ree levels of per-
formance are o ered from a 4-core Intel Core
i7-4700EQ, 2-core Intel Core i5-4422E to a
2-core Intel Celeron 2002E processor with
options for 16 or 32 Gbytes memory.
Artesyn: OCP platform for network
functions virtualization
Artesyn Embedded Technologies announced
its rst high performance integrated comput-
ing system inspired by Open Compute Project
(OCP) standards. e Centellis OCP Platform
is designed to help communication service
providers dramatically lower the capital and
operating expense associated with running
their networks by leveraging open standard
and open source hardware and so ware, and
taking advantage of virtualization and cloud
technologies.
ADL: PC/104 Consortium announces
OneBank option for PCI/104-
Express & PCIe/104
e PC/104 Consortium has announced
the latest revision of the PCI/104-Express &
PCIe/104 Speci cation, Revision 3.0, that pro-
vides an additional option called “OneBank”.
e PCIe/104 OneBank utilizes a smaller, low-
er-cost bus connector which is compatible to
the full size PCIe/104 connector currently in
use today. It allows designers to stack boards
using a complimentary format that frees up
PCB real estate for additional components as
well as potential cost savings.
Pentair: 100 Gbps AdvancedTCA
shelf for fast data transmission
Pentair is currently working on a Schro 100G
AdvancedTCA backplane. Recently, the IEEE
adopted the new 100 Gbps Ethernet standard
IEEE802.3bj which will be the base for 100G
Ethernet for AdvancedTCA. e IEEE stan-
dard de nes two signaling methods for 100
Gbps Ethernet data transfer over backplanes:
100GBASE-KP4 and 100GBASE-KR4. e
rst method uses PAM-4 coding at approxi-
mately 13Gbaud, while the second uses NRZI
coding at about 25Gbaud. Along with PCIe
4.0, the IEEE802.3bj will be the most signif-
icant standard for fast data transmission on
backplanes in the coming years.
Toshiba adds new members to ApP Lite
family for IoT solutions
Toshiba Electronics Europe has launched
two new application processors for wearable
devices. e TZ1031MBG and TZ1011MBG
are the latest additions to the ApP Lite fam-
ily’s TZ1000 series, and provide single pack-
age solutions for the Internet of ings. e
launch of the TZ1001MBG in November 2014
introduced a single-package application pro-
cessor that integrated data collection sensors,
data processing capability, ash memory for
data storage, and a Bluetooth Low Energy
controller for data communication. Build-
ing on this, the new application processors
expand sensing functionalities by adding a
gyroscope to the TZ1031MBG and a gyro-
scope and magnetometer to the TZ1011MBG.
Infineon: OPTIGA TPM 2.0 chips secure
Microsoft Surface Pro 3 tablet
In neon Technologies con rmed that its
OPTIGA TPM security controller is used
in the Microso Surface Pro 3 tablet. With
the rapid adaption of Internet of ings,
the opportunities for security breaches will
increase signi cantly. erefore, the compre-
hensive security solutions are essential to pro-
tect the device and its data and ensure long
term satisfaction of customers.
Silicon Labs launches Blue Gecko
Bluetooth Smart solutions
Silicon Labs unveiled a complete Bluetooth
Smart solutions portfolio designed to help
developers minimize the energy consumption,
cost and complexity of wireless IoT designs.
Silicon Labs’ recent acquisition of Bluegiga
accelerates the company’s ability to deliver
comprehensive Bluetooth Smart solutions. Sil-
icon Labs’ new Blue Gecko solutions include
ultra-low-power wireless SoC devices, embed-
ded modules, and Bluegiga’s so ware develop-
ment kit and Bluetooth Smart so ware stack.
DAVE: BORA Xpress CPU module based
on Xilinx Zynq XC7Z015/XC7Z030
From the 24 to the 26 of February 2015,
BORA Xpress will be unveiled at Embedded
World, where you can nd out more about
the complete range of CPU modules and
System-on-Module solutions from DAVE
Embedded Systems. BORA Xpress is the
new top-class Dual ARM Cortex-A9 + FPGA
CPU module by DAVE Embedded Systems,
based on the recent Xilinx Zynq XC7Z015/
XC7Z030 application processor. anks to
BORA Xpress, customers are going to save
time and resources by using a compact solu-
tion that includes both a CPU and an FPGA,
avoiding complexities on the carrier PCB.
