Some applications for systems such as in rail-
road and traffic systems, defense or for use near
rotating machines, demand relatively high shock
and vibration resistance levels. A suitable Schroff
systemplatform, together with the broad selection
of off-the-shelf components, enables standard
systems to be created with shock and vibration
resistance levels from 2 to 40g. Individual config-
uration of the mechanical system basis, using
Schroff 19" subracks, with side panels of various
thicknesses (screw-fixed or tox-cold welded), 19"
brackets and corner profiles and various versions
of horizontal rails such as a lightweight horizontal
rail with single-point fixing, a heavy rail with
two-point fixing or a version with three-point
fixing, enables shock resistance levels of up to
25g to be achieved. This is mostly sufficient for
many mobile applications, in defense systems
and similar environments.
Where higher robustness levels are called for,
another system basis is used. The enclosure
platform developed for this is formed of alu-
minum components (base, top cover, side,
front and rear elements) bolted together. A
hole grid in the side components, top cover
and base allows other optional parts such as
mounting brackets to be attached. The front
and rear elements are symmetrically designed
and have identical hole positions and bolt-on
dimensions. Various cut-outs can be integrated
here for sockets, switches etc. The guides for
the PCBs are milled into the base and top
cover of the case. This modular enclosure plat-
form is designed for shock and vibration levels
of up to 40g for non-military applications.
For some time Pentair has also been offering
system platforms for use in defense systems.
This Titan ATR system also achieves shock
and vibration resistance values of 40g. The
systems can also be equipped with high IP
and EMC protection. The cooling of the com-
ponents is realized with conduction cooling.
Additionally there is a mechanical system basis
that combines these two platforms: 19" sub-
racks plus high IP and EMC protection plus
conduction cooling. Such a system used, say,
as a laboratory system for conduction-cooled
boards, can also be constructed from off-the-
shelf components. These platforms offer users
the possibility of testing the technology or ap-
plication with the conduction-cooled boards
initially in the lab. The same components can
then also be built into a Titan ATR system.
By their nature, ordinary subracks do not have
high levels of IP or EMC protection since they
are very open. Protection of the system compo-
nents installed in them is generally provided by
fitting the subrack into a cabinet. The fronts of
the systems are then provided with appropriate
EMC gaskets. If the systems themselves have to
offer high EMC protection, they must be given
a practically solid cladding. The Titan and Titan
ATR system meet this requirement, though in
their basic configurations they are built without
appropriate gasketing. Where requirements are
higher, either a pure IP gasket or a combined
IP and EMC gasket can be (retro)fitted into a
groove provided for this purpose.
In most cases the cooling requirement and the
type of cooling are selected on the basis of
two criteria: the level of dissipation loss and
the location of the installation. If the boundary
conditions are met, air cooling by convection or
Built from standard components –
embedded systems for all purposes
O
PEN
S
TANDARDS
By Christian Ganninger,
Pentair-Schroff
Depending on the area of applica-
tion, embedded systems are subject
to highly varied requirements in
terms of mechanical stability such as
shock and vibration resistance, IP and
EMC protection and cooling. With its
systems based on modular Schroff
system platforms, Pentair offers
possibilities for fulfilling these differ-
ent requirements. Systems can be
assembled from a wide portfolio of
off-the-shelf components for any
level of ruggedness required.
Figure 1. Individually config-
ured subrack-based system
October 2013
10
Figure 2. Completely closed Titan ATR system:
high shock and vibration resistance, high
IP and EMC protection and high heat
dissipation capacity
