Feb 24, 2011


Special Issue: embedded world 2011 preview

 

Visit MSC/Gleichmann Group at the embedded world 2011
In Hall 9, Booth 463 we will be pleased to discuss technical issues with you in our category groups:
• Semiconductors: Microcontrollers • Frequency • Prog. Logic • Memory   Power   RF/Wireless
• LED Lighting: Component Solutions   LED secondary optics • LED development •etc.
• Displays: TFT displays in IPS / MVA technology etc.
• Embedded Computing: Qseven- and COM-Express-Module etc.

Freescale introduces the world’s most scalable 32-bit portfolio
Freescale presents the most scalable 32-bit MCU portfolio–Kinetis MCUs based on ARM Cortex-M4 technology. The Kinetis portfolio expands your 32-bit choices with over 200 pin- and software-compatible MCUs. Expand your options and speed your time to market with Freescale. Visit us at embedded world 2011, Hall 9, Booth 335 to explore our new Kinetis MCUs.

Wind River @ Embedded World
Wind River dedicates its presence at the show to the themes of “sustainability, consolidation, safety, security”. You will see the latest versions of our core products VxWorks and Wind River Linux, our technology solutions for multi-core and virtualization, and some examples of what our customers use our technology, our services and our know-how for. Hall 11, Booth 118

System modeling and simulation for multicore performance analysis
CoFluent Studio Eclipse-based system-level modeling and simulation environment for:
• Functional/behavioral real-time modeling using SysML/MARTE
• Executable specifications and SystemC use case model generation
• Multiprocessor/multithread execution simulation for performance/power prediction
Graphical modeling: no HW IPs or SW code needed. Hall 10, Booth 421b 

PLS and HighTec present joint Development Platform 
A joint Development Platform for TriCore, Power Architecture and Cortex-M will exhibited by HighTec and PLS. It is based on a GNU C/C++ compiler with leading optimization technology, long term support and perfect integration of Universal Debug Engine (UDE) in an Eclipse environment. Hall 10, Booth 215 and 407

Target Multiple Screens and Reuse Code Across Desktop and Embedded Platforms
Qt is an SDK containing tools for developing software for embedded, desktop and mobile platforms. Available commercially or via the LGPL, Qt lets developers create rich applications and UIs while reusing code across various platform deployments.  Come see our demos and visit us at Embedded World Hall 11, Booth 103.

Tools for developing reliable embedded software
AdaCore will present the latest developments in the open source GNAT Pro toolchain. Combining agility and ease-of-use, discover why GNATemulator (integrated, lightweight target emulation) and GNATcoverage (coverage analysis on both object code and source code) facilitate the life of the embedded software developer. Hall 11, Booth F224

HCC-Embedded’s Advanced Embedded Middleware (AEM)
These packages – scheduler, file systems, DICOM, USB stacks, TCP/IP – are designed for mission-critical applications that may require certification to standards such as IEC 61508 SIL-3, IEC 62304 and FDA 510(K).  AEM products are built to the highest verifiable standards, based on software audits and V model implementation, including change management.  Come see and discuss at EW. Hall 10, Booth 305

Three new small form factor modules with low power processors
Lippert will introduce three new small form factor CPU modules with latest processor technologies. With the new Intel E600 processor family, Lippert introduces a COM-Express Compact module, as well as an ultra small CoreExpress module. Additionally another CoreExpress module with a Marvell A310 ARM processor grows the product family. Hall 9, Booth 272

ADLINK Next Generation Intel-based Building Blocks
ADLINK Technology Inc. will participate in Embedded World 2011 and exhibit its new product line based on the latest Intel microarchitectures. Product focus includes platforms featuring the 2nd generation Intel Core processor family and the Intel Atom Processor E6xx Series. Hall 9, Booth 245

COM-Express module supports new ruggedized RAM module standard with ECC
Lippert will introduce new COM-Express module with Core i7 processor, supporting a new ruggedized DDR3 module standard. The standard was defined by the SFF-SIG organization and has dimensions of 67,5 x 38 mm. Mounted with 2 screws it can withstand highest shock & vibrations. Modules are available from various vendors like Swissbit and Virtium. Hall 9, Booth 272

2nd Generation Intel Core processor boards
Concurrent Technologies will display their latest 2nd Generation Intel Core processor boards, along with a wide range of products for OpenVPX, VME/VXS, CompactPCI, and AMC. Products, commercial and rugged conduction cooled, include single board computers, witches, mass storage, XMC/PMC carriers, and development systems. Hall 12, Booth 225

Diamond Systems – Experts in Embedded Computing Solutions
Diamond Systems recently announced Aurora, a PC/104 SBC with a 1.6GHz Intel Atom Z530 CPU. Aurora is the first conduction cooled SBC with a heatspreader designed to mount to your enclosure. Visit us at Embedded World, booth 9-164, to learn more about Aurora and our other conduction cooled solutions! Hall 9, Booth 164

MSC Vertriebs GmbH exhibits Qseven NVIDIA Tegra 2 on embedded world 2011
MSC presents its first ARM based Qseven products aside the newly introduced Intel 2nd generation Core 2 Duo on COM Express module. The MSC Q7-NT2 is build around the NVIDIA Tegra 2, complies to the current Qseven specification 1.2 and fits on existing Qseven baseboards using LVDS. The MSC CXB-6S is based on Intel’s SandyBridge technology and supports the latest embedded Quad Core processors on the COM Express form factor. Hall 9, Booth 463

published by ICC Media.