Toshiba Cortex M3

Embedded Newsletter

CONTENTS

Jan 19, 2011 – presented by
ICC Media

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Sponsor Message 
2nd Generation Intel Core i7 Improves Mini-ITX Motherboard Performance
The MITX-CORE-800 series of Mini-ITX motherboards from Emerson Network Power is designed for intelligent kiosk, digital signage, medical cart and slot machine applications and offer a flexible mix of features and expansion options. Featuring the 2nd generation Intel Core Processor Family, the MITX-CORE-800 will have better power and performance for both general and graphics processing and will be fully Intel vPro certified. 
CHIPS & COMPONENTS NEWS
  • Toshiba: ARM Cortex MCUs with 12Mbps on-chip USB device
  • Gleichmann: dual IO-Link master transceiver with integrated UARTs
  • TI: floating-point Piccolo MCUs for energy-efficient applications
  • MSC: startup bundle for Atmel`s Cortex-M3 SAM3N family
  • TOOLS & SOFTWARE NEWS
  • Keil: multi-core debugging for NXP LPC4000
  • ST releases EvoPrimer development platform for STM8 and STM32 MCUs
  • Green Hills announces support plans for 2nd generation Intel Core processors
  • Wind River: VxWorks RTOS selected by biopharmaceutical manufacturer
  • Toshiba: free resources for development of ARM-based LINUX systems
  • IAR extends Renesas MCU support with addition of RL78 device
  • Rutronik: energy-efficient, wireless M-bus module from Telit

    Sponsor Message 
    Intel Core i7 in three rugged levels
    With the 3U CompactPCI Board CP3002 Kontron brings the long term available Intel Core i7 processor in three rugged levels. The CP3002 not only speeds up multiprocessing tasks via hyper-threading technology (HTT), but also processes single-threaded tasks much faster thanks to the new Intel Turbo Boost technology. This allows for a clock speed of up to 3.33 GHz without exceeding the defined thermal design power (TDP).

  • BOARDS & MODULES NEWS
  • N.A.T.: AMC carrier with intelligent extender modules
  • Artila: compact size Linux-based ARM9 system-on-module
  • Kontron: nanoETXexpress 2.0 specification approved for ultra-sized modules

    Sponsor Message 
    PC/104-Express Graphics Processor With Scalable Performance For Embedded Applications
    The 104X-E4690 from LiPPERT features an ATI Radeon E4690 graphics processor. Its flexible performance scalability results in small power requirements from 8 to 25 watts, depending on the required graphics operation. The board comes with VGA, LVDS, and DisplayPort interfaces, as well as backlighting support. Linux and Windows operating systems are supported. 

  • ADLINK: acquisition module for audio and vibration testing
  • Amplicon: simplifying rackmount cabinet integration
  • DDC: EBR-1553 and MIL-STD-1553 on a single PMC card
  • Digi: multi-function wireless programmable terminal server
  • EKF: CompactPCI PlusIO rear I/O transition module
  • BVM: 3.5” SBC supports new Intel mobile Core i7/i5/i3 processors
  • GE: reflective memory node card delivers high speed memory sharing
  • Nexcom: Atom D525 based fanless computer for harsh environments
  • Moxa: industrial wireless solutions chosen by Malaysia Light Rail Transit
  • Curtiss-Wright: natural convection-cooled 4-slot OpenVPX system
  • MSI IPC: upgraded IM-QM67 platform supports multi-display for HD
  • Advantech: Embedded platforms based on 2nd Generation Intel Core processors
  • KNOW-HOW (White Papers, Webinars & more)

    Micros & DSPs Virtual Conference
    Freescale’s Kinetis industrial microcontroller platform and NXP’s new Digital Signal Controller architecture are only two of the many highlights of this Virtual Conference which provides more than 10 technical webinars about Microcontrollers, DSPs and more.

    Texas Instruments Industrial Automation Solutions Virtual Conference
    The needs of the Industrial market nowadays are to conserve energy, improve efficiency, increase productivity and improved reliability/quality. This free conference is composed of one online panel including all TI Industrial experts in one room, 10 Webinars and several Industrial demo videos.

    PCI Express for high performance CPU interconnect
    This free webinar will focus on using PCIe interconnect for CPU to CPU and blade to blade connectivity, explaining technical features that make it all possible and giving real application examples where it is being utilized today.

    The right choice for your 3G connected design
    Fueled by the explosive growth of smart phones, 3G connectivity to wireless WWAN networks has now become a basic requirement for an increasing number of new categories of mobile device. This white paper will outline why embedded 3G MCM modules are a great alternative to discrete WWAN integration.

    Avionics & Defence Electronics - March 16-17 in Munich
    Avionics & Defence Electronics Europe, on 16th and 17th March 2011 at the M.O.C. Event Centre in Munich, Germany, is an event that delivers high quality conference content. The event is supported by the industry’s leading associations.