Contents

July 13, 2011 - presented by

ICC Media

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Chips & Components News

Tools & Software News

Boards & Modules News

Video: COM Express® Technology

COM Express® defines standardized footprints and pin-outs for Computer-on-Modules. With the new Revision 2.0, PICMG® added the compact footprint (95x95mm) to the basic footprint (125x95mm) and extended the pin-outs being future-proof. New Digital Display Interfaces (DDI) and super-fast USB 3.0 are now integrated. The new Pin-out Type 10 in COM Express® Revision 2.0 supports perfectly modules in the ultra footprint (85x55 mm).