Embedded Newsletter

CONTENTS

Jan 12, 2011 – presented by
ICC Media

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Sponsor Message 
3U CompactPCI Intel Core i7 CPU Board for High Performance Applications
Emerson’s CPCI7203 3U CPCI CPU board comes with Intel Core i7 1.06 or 2.0 GHz processors, 1 to 4 GB DDR3-1066 soldered SDRAM, 4 GB MicroSD flash module, 64 MB SPI Flash and 256 kB MRAM. The I/O’s include 2 GbE, 2 USB and VGA front panel ports, and 2 USB, 2 SATA, RS232, and 4 PCIe x1 rear I/O ports. The Trusted Platform Module (TPM) enhances data security and encryption capabilities. 
CHIPS & COMPONENTS NEWS
  • Intel introduces 2nd Generation Intel Core processor family
  • Atmel receives ZigBee remote control certification using ATmega128RFA1
  • Infineon: fast-acting diode protects USB 3.0 ports from electrostatic discharge
  • TI: 2.4-GHz ZigBee network processor with ZigBee PRO stack
  • EasySYNC: bus-powered USB-to-CAN adapters
  • ADI: dual output synchronous controller for input voltages from 2.75 to 20 V
  • Rutronik to showcase energy-efficient complete solutions at embedded world
  • GreenPeak launches three new chips for RF4CE market
  • Swissbit: storage solutions for all industrial applications
  • LTC: 2- & 4-channel hot swap I2C multiplexers
  • ERNI: SMC connector family with additional pin numbers in all variants
  • Maxim: small 2-channel ADC in space-saving 4mm˛ WLP
  • Renesas:16 new 16-bit microcontrollers within the R8C/Lx Series
  • ST: RFID memory IC increases on-board data storage
  • Allegro: user-programmable linear Hall-effect sensor IC
  • austriamicrosystems upgrades non-volatile memory portfolio
  • Picochip announces dual-mode LTE/HSPA+ basestation
  • TOOLS & SOFTWARE NEWS
  • CMX: small footprint SSL/TLS option for TCP/IP applications
  • TenAsys supports 2nd generation Intel core i7 processor
  • Vector Fabrics eases code partitioning challenges at Embedded World
  • PLS presents latest version of its Universal Debug Engine
  • TI: Qi certified development tools and chipset for wireless power
  • EB: tool chain for HMI development with new 3D rendering concept
  • JTAG presents its debug tools at embedded world
  • Rohde & Schwarz: easier and faster linearization of active RF components
  • Green Hills to showcase fastest Trace probe at Embedded World
  • Ashling: embedded Linux debugging for MIPS based applications
  • OIS: open-standard integration platform for automotive
  • ARM launches Development Studio Linux Edition
  • Symtavision: scheduling analysis tool supports Infineon MCUs
  • Agilent: Infiniium 90000 X-Series oscilloscope named Test Product of Year
  • Mathworks: parallel computing support for Real-Time Workshop
  • IAR supports STM32 F-2 Cortex-M3 based MCUs
  • BOARDS & MODULES NEWS
  • AAEON: industrial HMI touch panel solution with TI OMAP 600 MHz processor
  • Kontron: embedded platforms with 2nd generation Core i3/i5/i7 processors
  • Advantech: AMC and CompactPCI boards with latest Intel Core i7 processors
    Sponsor Message 
    Mixed Doubles: CompactPCI Serial G100 and CompactPCI 2.0 F100
    MEN presents two new boards offering an easy connection of CompactPCI Serial and CompactPCI 2.0 via PCI Express. They enable the user to keep existing CompactPCI systems in use while at the same time benefiting from the fast serial point-to-point connections of CompactPCI Serial PICMG CPCI-S.0.
  • GE: 6U OpenVPX SBC utilizes 2nd generation Intel core processors
  • Emerson: Mini-ITX Embedded motherboards with Core i7-2710QE/ i5-2510E
  • IEI: SBCs with Intel Q67/QM67 chipset, USB 3.0, SATA 6Gb/s
  • Curtiss-Wright: OpenVPX 3U SBC features i7 Quad-Core processor
  • IBASE: Mini-ITX motherboard with QM67 Express chipset
  • Avalue: EPIC board with Core i5-2510E or Core i7-2710QE processor
  • congatec: COM Express SFF module with Core i7-2710QE processor
  • Concurrent: 3U OpenVPX SBC with quad-core/dual core processor
  • Axiomtek: power-optimized Atom N270 fanless embedded box computer
  • Moxa: RTU controller for mission-critical environments
  • COMMELL: Core i7/i5/i3 3.5-inch miniboard
  • MicroSys: System-on-Module with QorIQ P1011 CPU for harsh industrial
  • MSI IPC: mini-ITX motherboard with Intel Atom Pineview
  • MEN: mobile safety according to e1 certification
  • AMD: lineup of motherboard products for G-Series platform for embedded
  • ADLINK: new products with latest Intel microarchitectures at Embedded World 2011
  • DDC: SFF MIL-STD-1553 and ARINC 429 board 
  • KNOW-HOW (White Papers, Webinars & more)

    Texas Instruments Industrial Automation Solutions
    The needs of the Industrial market nowadays are to conserve energy, improve efficiency, increase productivity and improved reliability/quality. This free conference is composed of one online panel including all TI Industrial experts in one room, 10 Webinars and several Industrial demo videos.

    PCI Express for high performance CPU interconnect
    This free webinar will focus on using PCIe interconnect for CPU to CPU and blade to blade connectivity, explaining technical features that make it all possible and giving real application examples where it is being utilized today.

    The right choice for your 3G connected design
    Fueled by the explosive growth of smart phones, 3G connectivity to wireless WWAN networks has now become a basic requirement for an increasing number of new categories of mobile device. This white paper will outline why embedded 3G MCM modules are a great alternative to discrete WWAN integration.

    Agilent and modular PXI and AXIe Instrumentation
    This webinar highlights market demands and needs for modular tools and how customers can leverage technology to enhance time to market.

    High availability webinar - solutions for continuous, efficient operations.
    This free webinar takes a closer look at the latest features and benefits of solutions for continuous, efficient operations.

    Avionics & Defence Electronics - March 16-17 in Munich
    Avionics & Defence Electronics Europe, on 16th and 17th March 2011 at the M.O.C. Event Centre in Munich, Germany, is an event that delivers high quality conference content. The event is supported by the industry’s leading associations.