• Toshiba: ISO26262 certification for automotive applications
• Cypress: controller enables USB 3.0 test platform for Microsoft
• CML: low power, IF/RF quadrature demodulator
• Microsemi: SmartFusion reference design for industrial and medical displays
• ST: energy-saving general-purpose voltage comparator
• Analog Devices introduced 1-GHz dual-core Blackfin processors
• Xilinx ships transceiver-packed Virtex-7 X690T FPGAs
• Microchip: advanced analogue and digital integration to 8-bit PIC MCU
• Renesas kicks off RL78 green energy challenge
• Sharp presents expanded LED portfolio at Light + Building

• ALT Software becomes a division of Three2N International
• Digia: Qt Commercial for QNX Neutrino RTOS
• Altium releases Maxim board-level components as online resources
• GrammaTech introduces next-generation architecture visualization system
• Microchip simplifies C Compiler line for all PIC MCUs and dsPIC DSCs
• Enea: software support for TI’s C665x multicore DSPs
• Adeneo: Windows Embedded Compact 7 BSP for Xilinx’s Zynq-7000
• LDRA: certification solution for medical device manufacturers
• Lauterbach supports Freescale Qorivva MPC57xx and the ST SPC57x family MCUs
• Microsemi: SmartFusion reference design for industrial and medical displays
• Digi and Wind River: Cloud-connected wireless M2M solutions
• IAR supports ARM Cortex-M0+ and Freescale’s new Kinetis L
• Arrow: embedded networking tool based on Infineon`s XMC4000 MCU
• Express Logic: ThreadX-Lite for IAR Embedded Workbench users
• Enea adds Linux to its operating system solutions
• Agilent: Bluetooth low-energy RF test option for wireless connectivity test set

• Aitech: flexible COTS subsystem functions out of the box
• Embedded China（Shanghai）2012 & PCIM Asia 2012
• DDC awarded AS9100 Rev C quality management system certification
• TEWS: PMC module with high-density user-programmable FPGA
• GreenBase debuts module based on standard for ARM/SoC based COMs
• Beckhoff: Panel PCs and Control Panels in stainless steel design
• DATA MODUL: motherboards from Micro-Star International
• X-ES: ruggedized COM Express module
• Acrosser: 3.5" entry-level SBC for industrial applications
• MEN: ESMexpress COMs to become ANSI standard, compatible with COM Express  
• Eurotech: biometric face recognition systems for security applications
• Emerson: high performance VME/VXS single board computer
• BVM: Pico-ITX motherboard based AMD A55E Fusion
• Bicker: power solutions for industrial and medical systems catalogue 2012  

Five keys to software success
This white paper provides a brief overview of the interoperability advantages of Intel® architecture (IA) and discusses five ways in which the close collaboration between Intel and the 200-plus members of the Alliance helps ensure software success.

TI slashes total MCU power by 50% with new “Wolverine” MCU platform
TI achieves the “Wolverine” platform’s impressive power gains through its new 130-nm ultra-low-leakage (ULL) process technology, integrated low-power non-volatile memory and enhanced MSP430 DNA with advanced power management and precision low-power analog.

March / April 2012 issue of ECE Magazine
	Cover Story 32-bit microcontrollers with Cortex-M4 and innovative peripherals Contents - Microcontrollers - Embedded Wireless - Tools & Software
Download the latest issue of Boards & Solutions Magazine: as Electronic Magazine in PDF Format

March / April 2012 issue of Boards & Solutions Magazine
	Cover Story Want VPX? Try CompactPCI Serial! Contents - Embedded World Review - Rugged Embedded Systems - Small Form Factor Boards - Avionics
Download the latest issue of Boards & Solutions Magazine: as Electronic Magazine in PDF Format

published by ICC Media.