Sponsor Message

ONYX, SWaP-C Rugged Embedded Computer Assembled, tested and qualified, ONYX provides a SWaP-C platform ready to application, requiring no NRE. Based on COMe module Core i7 2nd and 3rd Gen to meet a wide variety of mission requirements (MIL-STD-810, DO-160). Particularly attention has been made on Embedded Video Graphics and computing engine features thanks AMD Radeon E6760 GP-GPU option with its 480 Stream Processors matrix providing up to 576 GFLOPs at 25W.

	Enpirion High Density DC-DC PowerSoC Products			Fujitsu at Embedded World 2012: Live demonstration of solutions for industrial markets FM3 MCU Family
	Transition of the embedded market to intelligent systems			RL78/G14 - The Smart Solution for Motor Control Applications
	Samtec highlights new interconnects for Embedded Small Form Factors			Xilinx Zynq™-7000
	Silicon Labs’ New Precision32™ MCU Family: Engineered to Make the Developer’s Job Easier			Make the Switch to TI MCUs
	Introducing The True Low Power RL78 Microcontroller Platform			Silica Lighting
	Silicon Labs Introduces Precision32™ Family of 32-Bit Microcontrollers at Embedded World 2012

	Introducing Ada 2012: the new benchmark for reliable, safe and secure systems			Model-Based UI Maintains focus on the Product and the User Experience
	EB taking AUTOSAR 4.0 to the road			Tips & Trends for Building Smart Products for a Smarter Planet
	Virtualization and Multi-core drive ECU consolidation in the car - challenges and solutions			IS2T platforms enable the next generation of embedded object-oriented man-machine interfaces

	Sponsor Message
	2012 Embedded Systems Outlook: download this white paper on trends in embedded from NI The Embedded Systems Outlook shares National Instruments insights on the direction of the embedded systems market, listing technology and business-level trends that impact the development of next-generation embedded systems. View and download the 2012 Embedded Systems Outlook at http://ni.com/eso

	LDRA Opens Division Dedicated to Comprehensive Certification Services			Airborne: MATLAB und Simulink for Simulation, Modeling, Control Design, Rapid Prototyping and HIL
	Intelligent Systems: Data collection and analysis from device to cloud			National Instruments RIO architecture
	Universal Multi-Core Workbench, Universal Access Device 2pro and XMC4000 support			IRQA for embedded
	From Device to the Cloud			DesignSpark PCB tool and DesignSpark Synergy development boards

	AAEON’s Industrial Motherboards			Acromag plans continued growth in European embedded computing market
	Learn about ADLINK's new Smart Panel, ARM-based COM, ATCA, Matrix and COM Express product offerings at Embedded World 2012!			Advantech, Microsoft and Intel share what they are deeply passionate about
	Visible Light Communication - data connection via light			OPALE V2 Intelligent IPC

Sponsor Message

PROFIVE P11 - Module for standard and industrial temperature application The PROFIVE P11 module has a versatile spectrum of applications and an outstanding value-price ratio by utilizing the Intel Atom processor E6xx series. To suit various needs and different demands of fanless embedded applications the module is available as standard and industrial temperature version in four different performance levels.

	New DIMM-EMEV2 with Cortex-A9 Dual- Core Processor			eFlex Platform
	One microcontroller platform. Countless solutions. XMC.			Advantech MI/O extension – New Extensible Platform for Efficient Development
	Kontron Highlights at Embedded World 2012 to increase efficiency			LiPPERT ADLINK Technology at the Embedded World 2012
	Slim, Smart, Cool - embedded computing solutions from Portwell			SECO introduces new ARM- and x86-based Qseven modules

published by ICC Media.