Daily Newsletter from embedded world 2011 - Wednesday, March 02

Renesas: RX200 32-bit MCUs cover 1.62 to 5.5 V operating voltage rage
Renesas introduces the first products in the new RX200 Series of 32-bit microcontrollers  with embedded Flash memory that extend its RX MCU family into the realm of ultra-low power and wide-voltage range operation. The RX200 MCUs operate up to 5.5 volts, comply with the IEC 60730 appliance safety standard, and have specialized motor control capabilities.

Infineon: 16-bit real-time signal controller portfolio for low-end industrial applications
At the Embedded World Show 2011, Infineon Technologies announced additions to its 16-bit XE166 Real-Time Signal Controller portfolio to address low-end and ultra low-end industrial applications. The new XE16xL and XE16xU Real-Time Signal Controllers provide 16-bit performance at 8-bit cost, supporting design of cost-effective electric drive systems for energy efficiency and mass market applications.

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Freescale introduces the world’s most scalable 32-bit portfolio Freescale presents the most scalable 32-bit MCU portfolio–Kinetis MCUs based on ARM Cortex-M4 technology. The Kinetis portfolio expands your 32-bit choices with over 200 pin- and software-compatible MCUs. Expand your options and speed your time to market with Freescale. Visit us at embedded world 2011, Hall 9, Booth 335 to explore our new Kinetis MCUs.

VIA: dual-core Eden X2 processor optimized for fanless implementation
At Embedded World 2011, VIA Technologies debuts the new low power VIA Eden X2 processor, optimized for fanless implementation in a broad range of industrial and commercial embedded systems. The Eden X2 processors combine VIA’s signature ‘Eden’ fanless design principles, in a highly optimized, power-efficient dual-core architecture.

Altium introduces new component management for Designer
At the centre of Altium Designer 10 sits a new design vault based concept of managing component data. It extends traditional design libraries to cover other design processes, in particular MCAD and industrial design, and business processes such as procurement and manufacturing.

Freescale: new i.MX53 multimedia products and development solutions
Freescale Semiconductor is expanding its i.MX53 high-performance applications processor portfolio with two advanced development platforms and new consumer and industrial devices.

LDRA increases automation and transparency of test process
With the adoption of process-oriented standards such as IEC 62304, IEC 61508:2010 and ISO/DIS 26262, software developers must comply with programming standards and provide requirements traceability. To ease compliance and requirements traceability, TBmanager, a component within the LDRA tool suite, has been extended to deliver greater transparency, implement consistent test plans throughout a team, and manage the flux between requirements, code and tests.

Enea: new software platform simplifies multicore migration
Enea will launch the Enea Multicore Migration Platform (MMP) which will help developers of multicore systems to migrate legacy applications from unicore to multicore preserving investment, while at the same time enabling the use of the latest high-performance multicore devices.

SYSGO extends SMP support from x86 to ARM, PowerPC and SPARC architectures
SYSGO announces the new 3.2 release of PikeOS, which extends SMP support from x86 to ARM, PowerPC and SPARC architectures, along with new SMP capable Linux Personality, performance improvements, and many enhancements in tools.

TenAsys: networked RTOS for multi-core, multi-platform Embedded systems
TenAsys announces a new scalable real-time OS called INtime Distributed RTOS at the Embedded World show. Based on INtime for Windows, INtime Distributed RTOS enables programmers to write applications that run without modification on different system configurations spanning from single-core or multi-core processor systems to multi-platform systems with multi-core processors. 

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	Hybrid Embedded system for real-time measurement and control tasks Hybrid embedded systems of the MSX-Box series by Addi-Data increase the efficiency of your applications: they are both fast and real-time capable. Thanks to the optimal matching of hardware and software you benefit from a perfect real-time hybrid embedded system with minimum jitter. Get more information: www.addi-data.com

Diamond Systems: rugged SODIMM variant targets Embedded apps
Diamond Systems, Apacer and Accelerated Memory Production unveiled RSODIMM, a specification for rugged SODIMM memory at the Embedded World 2011. The new memory module format offers a cost-effective way to satisfy the reliability requirements of performance-critical embedded computing applications.

Beckhoff: EtherCAT Box combines two analog inputs and outputs
Beckhoff has extended its range of IP 67 I/O modules with the EP4374 EtherCAT Box, which combines two analog inputs and two analog outputs in one device. With the combination of parameterisable inputs and outputs in a single housing, users benefit from increased flexibility and can utilise the existing signals in an optimal manner.

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PROFIVE P11 - Module for standard and industrial temperature application The PROFIVE P11 module has a versatile spectrum of applications and an outstanding value-price ratio by utilizing the Intel Atom processor E6xx series. To suit various needs and different demands of fanless embedded applications the module is available as standard and industrial temperature version in four different performance levels.

Emerson: flexible and affordable customization of Embedded motherboards
Emerson Network Power is introducing the  innovative RapiDex board customization service. The Intel Atom processor is the first to be supported, with other Intel embedded processors being added during 2011. 

emlix: Embedded Linux BSP for Fujitsu's AMD Embedded G-Series APUs
At Embedded World, Fujitsu Technology Solutions presents two brand new embedded boards based on the new AMD Embedded G-Series APUs. emlix developed hardware-specific Embedded Linux Board Support Packages for both boards.

TQ: x86 construction kit based on mini-ITX – now with “Sandy Bridge”
The MB-COME-1 motherboard combined with a standard COM-Express module is a very compact hardware kit that can be used as a freely scalable embedded-PC platform owing to its modular design. At 170 x 170 mm, the dimensions of the motherboard correspond to the mini-ITX form factor, and even the mount points correspond to those of a mini-ITX board.

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AAEON’s Leading Multi-Touch IP65 Panel PC with Seamless-Flat Design: ACP Series   AAEON announces the leading industrial-grade MultiTouch IP65 panel pc, ACP series. The pioneering techniques with 56mm-slim, anti-scratch, G-sensor & fanless design enable ACP series suitable for a wide range of infotainment applications, such as  IT management for patients’ records in hospitals, interactive learning system, attendance managing system, check-in system …etc.  . ACP series are available for 3 sizes: 15.6”, 18.5” & 21.5”. The selection of processors is from dual-core Intel Atom D510, Core 2 Duo to Core i7.Hall 9-137

Express Logic: downloadable application modules for ThreadX RTOS
During an interview at embedded world, John Carbone (left), introduced Express Logic´s downloadable application modules for its ThreadX RTOS. Downloadable application modules enable ThreadX-based applications to dynamically receive additional instructions from local mass storage or a network. Applications therefore gain increased functionality without the cost of an increased footprint or additional memory.

published by ICC Media.