Daily Newsletter from embedded world 2011 - Tuesday, March 01

Renesas: low-power microcontrollers with large capacity memory
Renesas Electronics announces the availability of its eight new 32-bit V850 microcontrollers, an addition to its existing J Series. They are designed for low power, portable applications with high density memory from 768 KB flash/80KB RAM to 1 MB flash/80KB RAM to support increasing memory demand.  

Atmel optimizes QTouch architecture for application-specific devices
Atmel's new family of QTouch capacitive touch controllers implement button, slider and wheel functionality on application-specific devices and provide an easy-to-use solution with no firmware development, reduced bill of materials and lower power consumption.

Mouser: MouserMobile multilingual site supports wireless phones and tablets
MouserMobile offers advanced features for multilingual, multicurrency support for design engineers and buyers. The mobile site supports wireless phones and tablets and features support for 16 languages and 16 currencies.

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Freescale introduces the world’s most scalable 32-bit portfolio Freescale presents the most scalable 32-bit MCU portfolio–Kinetis MCUs based on ARM Cortex-M4 technology. The Kinetis portfolio expands your 32-bit choices with over 200 pin- and software-compatible MCUs. Expand your options and speed your time to market with Freescale. Visit us at embedded world 2011, Hall 9, Booth 335 to explore our new Kinetis MCUs.

Swissbit: DDR3 SODIMMs with heat spreader and conformal coating
In order to increase the heat dissipation and to avoid thermal hot spots on the memory modules in systems with difficult cooling, Swissbit can add an aluminum heat spreader to the existing portfolio of DDR3 SODIMMs. The dual sided heat spreader is attached with a thermally conductive tape and increases the heat dissipating area, thus reducing the critical high case temperatures which otherwise might lead to failing bits.

Toshiba: ARM Cortex-M3 MCUs provide CAN, USB and I2C
Toshiba Electronics Europe has further expanded its family of high-performance 32-bit ARM Cortex-M3 microcontrollers with four new devices that combine high-capacity Flash memory with a variety of interface options. The TMPM361, TMPM362, TMPM363 and TMPM364 MCUs feature 1Mbyte of Flash memory, 64Kbytes of on-chip RAM and a static memory controller with a 16-bit external data bus that supports the addition of an additional 16Mbytes of off-chip memory.

Agilent expands mixed-signal and digital-storage oscilloscope portfolio
Agilent Technologies has expanded its mixed-signal and digital-storage oscilloscope portfolio with 26 new models that comprise its next-generation InfiniiVision 2000 and 3000 X-Series. The new InfiniiVision 2000 X- Series offers bandwidths from 70 MHz to 200 MHz and boasts the fastest waveform update rate in its class for superior viewing of signal detail and capture of infrequent events.

TI: power development kits remove switching noise
Texas Instruments' TPS54060 and TPS7A30/49 power management development kits remove switching noise and increase the performance of data converters, operational amplifiers, clocks and other signal chain devices. Designers can significantly enhance their system’s power performance by connecting the new TPS54060EVM-590 and TPS7A30-49EVM-567 evaluation modules for a complete low-noise reference design.

SYSGO: PikeOS supports Android as a guest OS
SYSGO is announcing support of the Android operating system as a new guest OS for its Safe and Secure Virtualization product PikeOS. The same safety and security certified technology allowing strict partitioning between critical and non-critical applications is today available for developers of more consumer oriented Android programs that they can now combine with real-time and legacy code.

Vector Fabrics: cloud-based tool eases heterogeneous multicore development
Vector Fabrics launches their vfEmbedded cloud-based tool that allows embedded engineers to partition and map their software onto complex multicore platforms. vfEmbedded supports specific multicore architectures that have different cores and can assign partitions to specific cores. The ARM Cortex A9 and x86 architectures are the first to be supported with more target types to follow.

MSC: scalable ARM-based nanoRISC modules
At embedded word 2011, MSC presents an innovative ARM-based module concept, that is especially suitable for cost-sensitive embedded applications. Due to their pin compatibility and the usability of various CPUs - the current range is from ARM9 derivatives clocked at 400 MHz up to 1 GHz Cortex-A8 cores - the new nanoRISC modules offer a high degree of scalability.

Moxa: hardware-based IEEE 1588v2 Ethernet switches
Moxa's PT-7728-PTP series switches, which support the IEEE 1588v2 protocol with hardware time stamping to deliver nanosecond-accurate synchronization over Ethernet networks, are the newest addition to the PowerTrans series of IEC 61850-3 Ethernet switches.

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	Mobile Safety Thanks to e1 Certification This qualification is based on ISO 9001 and is required for the application of electronic assemblies in road traffic. MEN Mikro Elektronik achieved an e1 type approval by the German Federal Motor Transport Authority and has already developed a number of products for use in mobile environments.

Kontron: double-width AMC module with Core i7 processor
Equipped with an Intel Core i7 Mobile processor and Intel Hyper-Threading technology, the AM5020 can produce up to 2.53 GHz of dual-core performance to run parallel, multi-threaded applications on MicroTCA integrated platforms.With its MicroTCA.1 faceplate design for robust system integration, the AM5020 is capable of withstanding demanding mechanical environmental conditions.

EKF: Micro SATA mezzanine module
Available as a mezzanine add-on expansion board to EKF CPU cards, the C42-SATA accommodates a 1.8-Inch Solid State Drive, as a rugged and extremely fast mass storage media, which can be easily removed. Micro SATA solid state drives are available with 160GB and beyond capacity, delivering generous space for installation of any popular operating system.

VIA: ruggedized touch screen displays with up to five years longevity support
VIA Technologies VIA VID series of industrial-class touch screen displays are designed for a range of modern interactive kiosk, POI and POS embedded systems, extending VIA’s position as a total system and embedded component provider. Available in both ruggedized and open frame configurations, the VIA VID series spans 7 to 19 inch form factors.

Fujitsu presents new mainboards of extended lifecycle series
Fujitsu Technology Solutions presents two new mainboards of the extended lifecycle series for semi-industrial use. In contrast to classical desktop mainboards, which usually have a lifetime from 12 to 18 months, the mainboards of the extended lifecycle series are available for another 24 months after the End-of-Life. The Micro-ATX-Board D3061-B is based on Intel’s chipset Q65 and the ATX-Board D3062-B on Intel’s latest chipset Q67.

Eurotech presents Everyware Device Cloud solution at embedded world
Eurotech will showcase its Everyware Device Cloud (EDC) solution at Embedded World together with latest additions to its platform portfolio. EDC is a platform that represents the most effective way for customers to design and deploy device-to-cloud solutions that deliver valuable data between distributed devices and business applications.

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Kontron VX3035: the highest power density for SWaP-optimized VPX applications Integrating the second generation Intel Core i7 2655LE processor, Intel HD graphics and features such as Intel Turbo Boost technology and Intel Advanced Vector Extensions (Intel AVX), the new 3U VPX CPU board defines a new performance class for SWaP (size, weight and power)-optimized high-performance embedded computing applications.

Energy efficiency and communication are key issues at Embedded World 2011
Starting today, the embedded world Exhibition&Conference 2011 is all set for yet another record event. Around 790 exhibiting companies – 7 per cent up on the previous event – from all over the world present their products and services at the biggest international exhibition and conference for embedded systems from 1–3 March. Exhibitors at embedded world will offer energy-optimized solutions and products in all product segments – hardware and software, tools and services. The priority is on efforts to cut energy consumption with increased system power. This makes it particularly clear that the embedded systems industry is one of the pioneers for saving resources in the future.

published by ICC Media.