ECE BAS March 2014 - Recom - page 31

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MEN: rugged COM Express with Intel
Core i7
Rugged COM Express or VITA 59 is a new stan-
dard which is based on the proven PICMGCOM
Express standard. Due to mechanical modifica-
tions, the modules are now also able to meet the
high requirements of critical markets regarding
temperature, shock and vibration, EMC com-
patibility and resistance against dust and humidity.
The Intel Core i7 processor family with a core
frequency of up to 2.1 GHz and a Turbo Boost
frequency of 3.1 GHz makes it possible to choose
between 1, 2 or 4 processor cores. As many as 16
GB DDR3 DRAM are soldered to the board. In
addition, Intel AMT, Open CL 1.1 and high-end
graphics are supported. The adaptable BIOS with
integrated Intel AMT support can be flexibly
adapted to the final applicationwithout additional
costs. The Board Management Controller super-
vises the board functions and temperatures.
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DFI: ATX motherboard supports multiple
PCIe configurations
DFI announces the DL631-C226 ATX industrial
motherboard based on 4th Gen Intel Xeon
processors. It is DFI’s first ATX board that sup-
ports the workstation Intel C226 express chipset
for high computing applications. This ATX
model comes with LGA 1150 socket for the
Intel Xeon processor E3-1200 v3 series built
on 22-nanometer process technology. These
processors offer higher computing performance,
they are more cost-effective, and they provide
more energy-efficient power consumption.
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ADLINK reaches Intel Intelligent Systems
Alliance Premier Level
ADLINK Technology announces its promotion
by Intel to Premier Member in the Intel Intel-
ligent Systems Alliance. The Intel Intelligent
Systems Alliance is composed of companies
that provide the hardware, software and
firmware that make up today’s advanced em-
bedded technology solutions. As part of the
Alliance, companies integrate existing toolkits
with Intel’s own software, as well as create
new tools, and offer systems integration and
other services that help their customers to
create more value in their vertical industries.
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Kontron extends COM Express portfolio
with E3800 and N2900/J1900 variants
Kontron launched two new COM Express
compact Computer-on-Module families with
Intel Atom E3800 series processors and Intel
Celeron N2900 / J1900 series processors. The
new modules extend the existing Intel SoC-
based COM Express portfolio to embrace es-
pecially powerful compact variants with full
type 6 I/O support including PCI Express,
LAN, USB and Digital Display interfaces. In
total, Kontron now offers 16 different config-
uration options in this COM Express Com-
puter-on-Module performance class.
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Lantiq and Würth: demo kit for “High
Speed Connection to the World”
Lantiq andWürth Elektronik announce the avail-
ability of a jointly developed demonstration kit
to provide an easy and fast way for implementing
Ethernet in a broad range of products. The Eval-
uation Kit paves the way to easily add Ethernet
hardware to an application or device and provides
all necessary information to understand the
demands of an Ethernet hardware design.
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Apacer: cloud-based SSD overcomes
bottleneck of big data access
Apacer has launched a high-end cloud-based
SSD - SFD (SATA Flash Drive) 25A, which sur-
passes SATA 2.0 interface SSDof enterprise server.
With adoption of SATA 3.0 transmission interface,
SFD 25A achieves double transmission capacity
and large storage capacities up to 256 GB. SFD
25A is suitable for On-Line storage in cloud
storage center to save the cost of server space so
as to optimize its operating conditions featuring
in high-speed, stability and power savings.
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Rutronik presents new COM form factor
efus by F&S
The new form factor for Cortex-A CPUs by
F&S Elektronik Systeme, efus, measures only
47 x 62mm. efus stands for easy, functional,
universal, small: It comes with various inter-
faces, is expandable with wireless modules and
suitable for universal use, e.g. for visualization,
communication, control in industrial and med-
ical applications. The first module of this new
product family, efusA9, is available for devel-
opment at distributor Rutronik by April 2014,
mass production starts by the end of quarter
2/14. Further modules will follow within 2014.
The efus product family, uses a common 230
pin MXM2 edge connector. The signals on the
base board leading to the plug connector were
routed by EasyLayout standard, the concept
of no crossing lines or avoidable through holes.
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Acrosser: video demonstration of
book-sized fanless Mini PC
To illustrate the high performance of AES-
HM76Z1FL, Acrosser created a short film, ex-
plicating the multiple features of their ultra
thin embedded system. From its exterior look,
this book-sized mini PC embodies great com-
puting performance within its small form fac-
tor. The arrangement of the I/O slot has taken
product design and industrial applicability
into consideration perfectly.
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April 2014
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NDUSTRIAL
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OMPUTING
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