October 17
38
P
roduct
N
ews
Toshiba: 3D Flash Memory with TSV
technology with high speed data input
and output
Toshiba announced development of the BiCS
FLASH three-dimensional flash memory uti-
lizing Through Silicon Via (TSV) technology
with 3-bit-per-cell (triple-level cell, TLC)
technology. Devices fabricated with TSV tech-
nology have vertical electrodes and vias that
pass through silicon dies to provide connec-
tions, an architecture that realizes high speed
data input and output while reducing power
consumption. Real-world performance has
been proven previously, with the introduction
of Toshiba’s 2D NAND Flash memory.
Infineon: packaged MEMS microphones
with a 70 dB signal-to-noise ratio
Infineon Technologies is entering the pack-
aged silicon microphone market. With this it
is addressing the needs for high performance,
low noise MEMS microphones. The analog
and digital microphones are based on Infine-
on’s dual backplate MEMS technology and
distinguish themselves with a 70 dB signal-to-
noise ratio.
ROHM: evaluation boards for USB type-C
USB power delivery
ROHM has recently announced the availabil-
ity of USB Power Delivery (USBPD) compat-
ible transmitter/receiver evaluation boards
designed to connect to information and
peripheral devices using the new Type-C con-
nector. The new USB Type-C connector and
USB Power Delivery standard developed by
the USB Implementers Forum are attracting
increased attention, featuring a breakthrough
interface that boasts a compact, reversible/
flippable connector capable of simultaneously
transmitting data and scalable power over a
wide range.
Apacer: DDR4 wide temperature memory
modules reinforced with underfill
technique
Apacer Technology, with the full support of
its strategic partner Samsung Electronics, has
built its DDR4 wide temperature memory
module series with positive market response.
Using industrial-grade chips, the memory
module series provides a rugged solution
for industrial equipment operating under
extreme temperatures for long hours.
Xilinx: SDAccel development environment
available for Amazon EC2 F1 instances
Xilinx announced that its software defined
development environment, SDAccel, is
now available on Amazon Web Services for
use with Amazon Elastic Compute Cloud
(Amazon EC2) F1 instances. Amazon EC2
F1 instances provide reconfigurable, cus-
tom-hardware acceleration with 16nm Vir-
tex UltraScale+ FPGAs enabling customers
to meet the demands of compute-intensive
workloads like data analytics, video process-
ing and machine learning.
Würth Elektronik: get to your virtual
component faster
Würth Elektronik eiSos has integrated com-
ponent libraries for Altium, Cadence OrCAD
& Allegro, CADSTAR, Eagle, LTspice, Mod-
elithics and S-Parameter to create a special
service for electronics developers. Whereas up
to now the data models have been available
as downloads on the individual product pages
of the online catalogue, Würth Elektronik
eiSos now provides them centrally in a clearly
arranged fashion, accessible by the target soft-
ware.
Renesas: PLC solution enables voice
communication over power lines
Renesas Electronics announced a new voice-
over-power line communication solution that
enables both data communication and voice
communication capabilities over existing
power networks. The PLC solution reduces
the amount of internal wiring required in
buildings, enabling reduced implementation
and maintenance costs for public address sys-
tems and security systems.
NXP introduces 8-bit S08 MCU measuring
3 x 3 x 0.9 mm
NXP Semiconductors announced its smallest
8-bit S08 microcontroller – the MC9S08PA4A-
VDC microcontroller. Measuring just 3 x 3 x 0.9
mm, this new package helps address the grow-
ing challenge of shrinking PCB space for tomor-
row’s technologies, without increasing BOM
costs. The MC9S08PA4AVDC can be used in
various size-limited applications such as indus-
trial control, BLDC motor control and Internet-
of-Things control that requires a tiny MCU.
ams: magnetic position sensors with
ISO26262 compliance
ams announces a new series of magnetic posi-
tion sensors with increased safety and diag-
nostic capabilities to help automotive OEMs
achieve the highest in ISO26262 ASIL sys-
tem safety-level compliance. The AS5270A/B
devices are ideal for many automotive applica-
tions including brake and gas pedals, throttle
valve and tumble flaps, steering wheel posi-
tion, chassis ride-height, Exhaust Gas Recircu-
lation (EGR) valves, fuel-level measurement
systems, and 2/4 wheel drive switching.
Laird: 802.11ac Wi-Fi + Bluetooth
5 module for challenging wireless
environments
Laird introduced a new series of Wi-Fi and
Bluetooth modules that provide unmatched
connectivity, and improves network efficiency
and spectrum use. The new modules also
enable optimal mobile device performance in
the most challenging wireless environments.
The Sterling 60 family of certified 802.11ac
2x2 MU-MIMO Wi-Fi + Bluetooth v4.2 mod-
ules (Bluetooth 5 SIG certified Q4 modules)
is the first of two classes of modules that will
give developers unmatched flexibility in wire-
less design.
Pentair: higher efficiency and larger
temperature range for power supply
portfolio
Pentair is updating and streamlining its
Schroff power supply portfolio. Various series
of AC power supply products are being com-
bined into the MaxpowerPro product family.
The first devices in the new Maxpower supply
unit series feature 180 W of output and are
currently available. The power supply units
from the former SEK series have been rede-
signed and are now available under the name
Max50.
Commell
21
Express Logic
40
Green Hills
5
Kontron
19
Mesago
39
Microchip
11
PEAK Systems
13
Portwell
3
SECO
17
Sintrones
23
Supermicro
7
Würth elektronik
2
COMPANY
PAGE
Advertisers Index
