November 2016
54
I
ndustrial
C
ontrol
& C
omputing
The guiding principal has been that there
should be no damage if a V1.1 compliant
module is placed into a V2.0 compliant car-
rier, or if a V2.0 compliant module is placed
into a V1.1 compliant carrier.
SMARC 2.0 – what’s new? The new version
V2.0 will repurpose selected V1.1 pins that
are underused for new interfaces in order to
keep the compatibility with the V1.1 pins.
No damage will be caused to modules that
were placed in a V2.0 compliant carrier or
inverse with a V2.0 compliant Module in
a V1.1 compliant Carrier. New interfaces
include 2nd channel LVDS, a 2nd Ethernet
port, IEEE1588 Trigger Signals, a 4th PCI
Express Lane, extra USB ports (now up to
6x USB 2.0 + 2x USB SS signals), x86 power
management signals, eSPI and DP++. Three
digital displays: as primary display, 2x 24 bit
LVDS or eDP (4 channels) or MIPI DSI (4
channels) can be used, the secondary display
can either be HDMI or DP++ and the third
display can be DP++.
Undoubtedly, SMARC 2.0 will be the basis of
many innovative and sophisticated applica-
tions over the next few years and Kontron, as
one of the world leading embedded comput-
ing technology manufacturers, fully intends
to remain at the forefront of SMARC inno-
vation. The company already has Version 2.0
product introductions scheduled for late 2016
and these, like all current Kontron embedded
boards and controllers, will be Internet of
Things ready and benefit from deep software
integration.
n
Avalue: Bytec’s second gen Geni-Tec
power solution for healthcare market
Avalue Technology’s healthcare alliance part-
ner Bytec has released for sale their G2 Geni-
Tec Mobile Power solution designed for use in
healthcare environments. Bytec’s core focus
is to ‘Mobilise Healthcare’, bringing a reliable
and safe power solution to hospitals, integra-
tors and medical device manufacturers to add
value to their systems, products and solutions.
CES: dual processor Intel Core i7 6U
OpenVPX SBC
Creative Electronic Systems announces the
CIO5-2040: a SWaP optimized dual pro-
cessors SBC combining 1.5 TeraFLOPS and
210K DMIPS of processing power, 40Gb of
Ethernet throughput and a composite frame
enabling the board to provide its entire
capacity all the way up to 85°C. Aimed at
serving High Performance Embedded Com-
puting applications such as radars, COMINT,
SIGINT or ELINT, the CIO5-2040 is built
using a mirrored architecture implementing
two Intel Core i7 Gen5 processors. The pro-
cessors are fed with data through four 10Gb
Ethernet links and three PCIe Gen3 x8 links
routed in the backplane.
Manhattan Skyline: compact NXP Cortex
A7 module designed for easy plug-in
The efusA7UL module from Manhattan Sky-
line is built around an NXP i.MX7 Ultralite
processor using an ARM Cortex A7 Core. The
47m x 62mm form factor combined with low
power consumption makes it very suitable
for compact designs. The module is designed
with up to 1GB SLC NAND Flash, 1GB RAM,
32GB eMMC. Interfaces include 2 x SD Card
Slot, Wi-Fi, Bluetooth, 4 x serial, USB 2.0, 2
x CAN, 2 x I2C, 2 x SPI, I2C audio and an
LCD interface for TFT plus touch 4 – wire and
PCAP via I2C). Available operating systems
are Linux (Buildroot/ Yocto) and Windows
Embedded Compact 2013.
IBASE: compact fanless system powered
by 5th gen Intel Core processor
IBASE Technology announces the release of
ASB200-909, a new compact fanless system
based on the IBASE IB909 3.5-inch SBC pow-
ered by a 5th Generation Intel Core i75650U or
ir-5350U processor with 4GB DDR3L memory
on board. Designed for automotive and fac-
tory automation applications, the ASB200-909
comes with low power consumption and sup-
ports an optional 60W power adaptor, VESA
mount bracket, as well as a 12V~24V DC wide-
range power input terminal block on the rear
of the system. Other external I/Os include four
serial ports, two USB 3.0, two USB 2.0, one
DVI-I, two RJ45 Gigabit Ethernet connectors,
a CFAST socket, HDD LED and power button.
Concurrent: new 10 GbE switch enables
3U VPX server configurations
Concurrent Technologies announces FR 351/
m06, a new 3U VPX switch with 10 Giga-
bit Ethernet connections for up to six server
grade payload boards and designed to opti-
mize the Size, Weight and Power metrics of
rugged server configurations. When used in
conjunction with Concurrent Technologies’
TR C4x/msd, which is based on the Intel Xeon
processor D-1500 and includes native 10
Gigabit Ethernet connectivity, solutions can
include up to 96 Intel Xeon cores and 192GB
of DDR4 memory.
PEAK-System: 8 CAN channels for
CompactPCI Serial
In cooperation with PEAK-System, the com-
pany EKF offers the carrier card SP4-0980-
MAMBO for CompactPCI serial backplanes,
applied, for example, to automotive test sys-
tems or industrial controls. With four CAN
interfaces PCAN-miniPCIe from PEAK-Sys-
tem, the carrier card provides eight CAN
channels at its front panel. They are galvani-
cally isolated from the remaining circuits and
against each other.
u-blox: LTE Cat 1 module for IoT featuring
proprietary LTE modem technology
u-blox unveiled the UBX-R3, its proprietary
LTE modem technology platform. The plat-
form supports the LARA-R3 module series, the
only cellular product in the market to feature a
combination of a Cat 1 LTE modem and GNSS
technology, all developed by a single supplier.
Manhattan Skyline: PicoITX SBC featuring
NXP i.MX6 processor
The armStoneA9r2 is a compact and very
powerful Single Board Computer in PicoITX
form factor. It comes with NXP i.MX6 Solo/
DuaLiite/ Quadplus ARM Cortex –A9 with
max 1GHz; up to 4GB DDR3L RAM , 1GByte
SLC Flash , 32GB eMMC; TFT via 2 x LVDS
and DVI; capacitive and resistive touch pan-
els via I2C; SD card, Ethernet, USB , CAN ,
serial , WLAN , Bluetooth.
congatec: first COM Express type 7
modules with Intel Xeon D processors
congatec is introducing new Server-on-Mod-
ules with Intel Xeon D processors parallel to
the preview release of the COM Express Type
7 specification. Based on the COM Express
Basic standard form factor (95 x 125 mm), the
modules feature 10 Gigabit Ethernet inter-
faces, 32 PCIe lanes and headless server per-
formance currently with up to 16 server cores
and 48 gigabytes of DDR4 ECC RAM.
S.I.E: individual embedded computing
system for the medical environment
The expert focuses on an individual approach:
In addition to the local expertise, the process
entry and the service depth can be chosen for
all the phases of the product development
process - individual elements consisting of
hardware, a software platform and services
through to the full development of a sophis-
ticated embedded computing system in the
medical environment are possible.
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