November 2016 - page 31

November 2016
31
Embedded Forum
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ROHM: PMIC optimized for Intel’s next-generation Apollo Lake chip architecture
ROHM has recently announced the availability of a power management IC (PMIC) developed for the latest announced Intel processor designed for
2-in-1 tablets and cloud books where reduced power consumption and a thinner, smaller form factor are increasingly demanded. The BD2670MWV
provides all power supplies required by Apollo Lake platforms while contributing to lower power consumption.
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HEITEC renames former Rittal packing systems products
In 2010 HEITEC took over the customer-specific products from Rittal. Then, at the beginning of 2013, the complete product portfolio of electronic
packaging systems, including design, manufacturing and marketing of all standard products, was transferred from Rittal to HEITEC as well as the
domestic sales of these products. Since 2015, HEITEC has been establishing step by step their own international network of distributors who now
distribute the standard products and are able to realize system solutions. Actually 25 countries are covered by 14 new distributors who can provide
local customer support. Only in Russia, Italy and the UK sales are still handled by Rittal.
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