Exhibition Highlights
ROHM: innovative products and concepts for power and energy
management
ROHM Semiconductor will showcase cutting-edge power manage-
ment solutions for numerous applications in the automotive, indus-
trial and residential/home arenas. Utilising the latest SiC and Si
technologies, proprietary processing and packaging technologies,
these devices maximise efficiency and compactness, paving the way
for cost and component reduction while delivering optimum per-
formance. Combining ROHMs knowhow in analogue and digital
power technology, they represent the most advanced developments
of ROHM’s global R&D centers and joint designs with industry part-
nerships. All these products are manufactured in the company’s fully
owned, vertically integrated production sites. Among others, key top-
ics will include 3rd Gen SiC MOSFETs, Schottky barrier diodes and
Modules, LED-Drivers for exterior Lighting, Design Kits for wireless
power delivery and the technology partnership with Formula E-car
developer Venturi. Utilising a proprietary double trench gate struc-
ture, ROHM’s new generation of SiC MOSFETs reduces ON-resis-
tance by 50% and input capacitance by 35% in the same chip size
compared with planar-type SiC MOSFETs. Optimum performance is
achieved by combining exceedingly low loss with high-speed switch-
ing performance. As a result, conversion efficiency is improved, con-
tributing to increased miniaturisation, weight reduction, and greater
energy efficiencies. The 3rd Gen of SiC Schottky Barrier Diodes real-
ise lowest forward voltage and lowest reverse leakage current over the
entire temperature range among all of the SiC SBDs currently avail-
able on the market. In addition to this, they feature high surge current
capability which is ideal for power supply applications. Adding to the
recently announced TO220AC devices at 650V/6, 8 and 10A, ROHM
will introduce D2pak devices also adding lower current options,
2A and 4A to the family. ROHM’s new full SiC modules including
a chopper type module for converters integrating both, Trench SiC
MOSFETs and SiC SBDs.
Polyrack Tech-Group: partner for enclosure and system
solutions
The Polyrack Tech-Group will be presenting itself as a cross-techno-
logical partner for standard and customized enclosures and system
solutions for a wide variety of markets. The wide range of expertise of
the Polyrack Tech-Group in mechanics, plastics technology, surface
treatment, electronics and assembly is represented through different
solutions and demonstrated in a mix of materials. POLYRACK sup-
ports their customers starting with the process development through
the design of products and systems including consultation for the
most efficient technologies and materials. Solutions range from var-
ious sizes for applications in automation, automotive engineering
(certificate in accordance to ISO/TS 16949), railway, transportation
and traffic technology, aerospace technology (certificate in accor-
dance to ISO 9100 in process), broadcasting, medical technology as
well as test, measurement and control technology.
TI: industrial and automotive innovation
Texas Instruments will showcase innovation focused on the future
of industrial automation and automotive technologies. Visit the
industrial demo showcasing TI technology enabling Industry 4.0
and the smart factory of tomorrow leveraging TI solutions for real-
time Ethernet with EtherCAT. Take a closer look at sensor com-
munications with wired technologies like IO-Link and wireless
technologies such as Bluetooth low energy, and explore how TI’s
gallium nitride technology significantly increases the efficiency in
variable speed motor drives. Discover innovation in automotive all
in one car. The Evolution Car 2020 (EvoCar) showcases how TI’s
automotive portfolio, including DLP products, enables advanced
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November 2016
