April 18
33
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Bridgetek: EVE graphics controllers with
ASTC functionality
Further extending its multi-award win-
ning embedded video engine (EVE) product
offering, Bridgetek has now introduced the
BT815/6 series of highly advanced graphic
controller ICs for next generation human
machine interface development. Support for
the Adaptive Scalable Texture Compression
(ASTC) algorithm means that image quality
can be significantly enhanced without need-
ing greater bandwidth to be allocated as the
compression algorithm allows for smaller
compressed files.
PragmaDev: Studio V5.3 offers cyber
physical system modeling capabilities
with FMI support
PragmaDev Studio is a recognized modeling
tool to describe complex communicating sys-
tems. Cyber Physical Systems combine event
driven and clock driven elements, critical parts
and non critical parts. For that purpose Prag-
maDev Studio V5.3 introduces the support of
Functional Mockup Interface FMI V2.0.
Maxim: uSLIC power modules
revolutionize design for highly
space-constrained applications
Designers working on space-constrained
applications can now dramatically reduce
solution size and increase efficiency with the
family of micro system-level IC (“uSLIC”)
modules from Maxim Integrated Products.
The MAXM17532 and MAXM15462 ultra-
small (2.6 x 3.0 x 1.5mm), integrated DC-DC
power modules are part of Maxim’s exten-
sive portfolio of Himalaya power solutions
that enable industrial, healthcare, communi-
cations, and consumer markets. With these
modules, customers get the full benefits of
industry-best switching regulators with the
size and simplicity of a linear regulator.
Xilinx unveils adaptable computing
product category
Xilinx announced a new breakthrough prod-
uct category called Adaptive Compute Accel-
eration Platform (ACAP) that goes far beyond
the capabilities of an FPGA. An ACAP is a
highly integrated multi-core heterogeneous
compute platform that can be changed at
the hardware level to adapt to the needs of
a wide range of applications and workloads.
An ACAP’s adaptability, which can be done
dynamically during operation, delivers levels
of performance and performance per-watt
that is unmatched by CPUs or GPUs.
Lattice: IP core support for iCE40
UltraPlus family
Lattice Semiconductor released its new FPGA
software, Lattice Radiant, targeted for the
development of broad market low power
embedded applications. With its rich feature
set and ease-of-use, Lattice Radiant software’s
support for iCE40 UltraPlus FPGAs greatly
expands the device’s application across broad
market segments including mobile, consumer,
industrial, and automotive. iCE40 UltraPlus
devices are the world’s smallest FPGAs with
enhanced memory and DSPs to enable always
on, distributed processing.
Renesas: MCU using advanced 28nm
Embedded Flash technology
Renesas announced the sample shipment
of the industry’s first on-chip flash memory
microcontroller using a 28 nm process tech-
nology. To contribute to the realization of
next-generation green cars and autonomous
vehicles with higher efficiency and higher reli-
ability, the revolutionary RH850/E2x Series
MCU incorporates up to six 400 MHz CPU
cores, which makes it the first on-chip flash
memory automotive MCU to achieve the
industry’s highest processing performance of
9600 MIPS.
The new MCU series also features a built-in
flash memory of up to 16 MB as well as
enhanced security functions and functional
safety. Targeting ASIL-D, the highest level
of the ISO 26262 functional safety standard
for automotive E/E systems, the RH850/E2x
Series adopts the dual core lock step CPU
structure that guarantees that the calcula-
tions performed by two CPU cores are iden-
tical. The RH850/E2x also provides up to
four sets of CPU pairs, and features a variety
of hardware functional safety improvements.
In applications where a system malfunction
could lead to life-endangering accidents, these
features immediately detect faults should a
malfunction occur and allow system safety
to be maintained. Renesas will provide safety
analysis tools that can flexibly support a wide
range of use cases to implement safe systems.
Under Renesas autonomy, an open, inno-
vative and trusted platform for assisted and
automated driving, Renesas provides end-to-
end solutions that advance the evolution of
vehicles towards next-generation green cars,
connected cars, and autonomous-driving
vehicles. The 28nm-generation automotive
control MCU is a new breakthrough prod-
uct featuring next-generation technology for
achieving vehicle control, which, together
with the R-Car Family of systems-on-chip
designed for cloud connectivity and sensing,
constitute the two main pillars of the Renesas
autonomy Platform.
TI: 1-A DC/DC step-down power modules
feature tiny MicroSiP packaging
Texas Instruments two new 4-V to 36-V
power modules that measure just 3.0 by 3.8
mm and require only two external compo-
nents for operation. The 0.5-A LMZM23600
and 1-A LMZM23601 DC/DC step-down
converters achieve up to 92 percent efficiency,
which minimizes energy loss, and feature tiny
MicroSiP packaging that shrinks board space
by up to 58 percent. The converters expand
TI’s power module portfolio to address up to
1-A performance-driven, space-constrained
communication and industrial designs,
including field transmitters, ultrasound scan-
ners and network security cameras.
Apacer upgrades to new-generation
DDR4-2666 memory modules
The rapid confluence of artificial intelligence
(AI) and the Internet of Things (IoT) have
not only fueled an increasing demand for
various smart application and smart devices
and servers, but also increased performance
demand in computing power and transfer
speed. In response to the successive upgrade
in Intel’s and AMD’s servers, desktop proces-
sors, and mobile processors platforms, as well
as the increased support of adaptation of the
DDR4-2666 specification, Apacer has out-
paced its competitors in the mass production
of DDR4-2666 memory modules for server
and industry applications.
