ECE / BaS August 2015 - page 3

Dear Readers,
3
V
IEWPOINT
August 2015
In the recurring seasons of the year
the months July and August mark
the summertime with usually a lot of
sunshine and tropical heat. And like
the annual recurrence of the summer-
time also the yellow pages of Boards
& Solutions + ECE return again every
year in the July/August issues. Like
last year this year the edition of
YellowPages 2015 – e Embedded
Companies Directory
is year’s edition of our Embedded
Companies Directory is split into
2 sections.
e st part provides
you with short company pro les, including a QR code which
leads you to the full company pro le (including overview about
products & services, contact information, product news,… )
on the embedded-control-europe.com portal. e second part of the
Yellow Pages is a reference list showing in which product categories
the companies are active.
But – as usual - beside the Yellow Pages 2015 this August issue con-
tains much more information about actual trends in the embedded
market place to keep our readers updated. If you look for example
at microcontrollers a basic product in the embedded industry you´ll
recognize the ongoing trend to increased use of ARM cores and
customer speci c or application speci c peripherals. is means also
you have to have the corresponding development environment to
create the required so ware. For this reason In neon for example is
providing an extensive peripheral- and application-oriented compo-
nent-based code repository in its Eclipse based DAVE development
platform.
e company now has systematically further developed
and expanded its development platform to Version 4 in order to allow
abstracting scalable yet e cient hardware-level, component-based
programming for its XMC microcontrollers.
e adaptations and
expansions include, among other things, improved data models and
improved graphics, scalable so ware drivers for individual periph-
erals, the device driver, the XMC Lib, and so ware components
for dedicated applications so called DAVE APPs.
e depiction,
modularity, and abstraction in the development environment
simplify the reusability and e ciency of the so ware development.
Another article explains in detail why the Internet of ings, as well
as the ever-decreasing timescales in the embedded development is
driving the industry to the development kit revolution. In recent
years there has been a huge increase in the number of development
kits from major semiconductor manufacturers that are available to
hardware engineers designing all sorts of end products.
But do not forget the “good old oscilloscope” in the development
of embedded products.
ese instruments have passed through
major innovations like the improvement of trigger functions and
long segmented memory options to ful l the increasing challenges
of complex embedded product design.
is issue contains two
corresponding articles.
Yours Sincerely
Wolfgang Patelay
Editor
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