Cadence Design Systems announced the Cadence
Liberate Trio Characterization Suite, a unified library
characterization tool that runs both statistical and nominal
characterization in parallel and provi...
IAR Systems announces tools support for the new
SAM L10 and SAM L11 microcontroller families from Microchip. Using IAR
Embedded Workbench for Arm companies can maximize the performance of
Looking for superior embedded graphics
performance with support for multiple 4K displays, 10 bit HDR and high
performance GPGPU capabilities, computing performance of up to 3.6
TFLOPs? And all this in a low TDP envelope to optimize the SWaP-C of
your designs? Then you should definitely evaluate our new AMD Ryzen
Embedded V1000 based conga-TR4 COM.
Functional safety applications in cars often
require substantial system design efforts. With XENSIV TLE5014,
Infineon Technologies is now launching a new magnetic angle sensor
family that is both read...
Microchip announces the new SAM L10 and SAM L11
families of 32-bit microcontrollers (MCUs) which address the growing
need for security in IoT endpoints by protecting against the increasing
the risk of...
The MP70S is developed according to
ARINC 600 and suitable for versatile and long-term use thanks to its
open standard architecture. Being a typical IFEC platform, it is, for
example, used for cabin entertainment, wireless data transmission or
for maintenance purposes.
Analog Devices announces the Power by Linear
LTC4291/LTC4292 isolated 4-port power sourcing equipment controller
chipset designed for use in IEEE 802.3bt (PoE++) Power over Ethernet
(PoE) systems. The...
Eurotech announced that AVR has chosen the
ReliaGATE family of intelligent edge computers running Eurotech’s
Everyware Software Framework and Everyware Cloud to manage the edge
devices for its s...
DIGI XBee® XGI Industrial Gateways
connect XBee enabled devices to remote applications over cellular or
Ethernet networks. These gateways feature scalable remote configuration
and management of Digi XBee networks and offer an extended temperature
range and a rugged enclosure.
congatec teams up with OSADL, Open Source
Automation Development Lab, to optimize the board support for Real-Time
Linux and showcase it in the OSADL test racks. In a first step, OSADL
Speed time to market and significantly reduce
design cycles with EMI-compliant, Himalaya step-down switching
converters and power modules from Maxim Integrated Products. These
solutions, which comply ...
The Silicon Labs' Blue Gecko BGM13P
Bluetooth module integrates EFR32BG13 wireless SoC with a complete
Bluetooth software stack and antenna to provide a complete,
pre-certified plug-and-play Bluetooth 5 and Bluetooth mesh
Solid Sands, supplier of SuperTest test and
validation suite for C and C++ compilers and libraries, and AbsInt, the
specialist for program analysis tools for safety-critical software,
announce their c...
Rohde & Schwarz introduces two new compact
midrange signal generators that offer versatility and performance in a
very small footprint. The R&S SMB100B analog RF signal
generator and the R&...
The UDOO Team is back on Kickstarter
the UDOO BOLT, the world’s first maker board based on AMD Ryzen™
Embedded V1000, mounting a CPU almost twice as fast as a MacBook Pro
13” and an Arduino-compatible platform for a starting price of $229.
Hurry - early birds are flying fast!
LDRA and Lynx Software Technologies extended their
partnership to integrate the LDRA tool suite with the LynxSecure Safety
Bundle announced this week. The LDRA tool suite is already available
for use ...
Texas Instruments introduced three new amplifiers
with a unique combination of high speed and high precision, allowing
designers to create more accurate circuits for error-sensitive
applications. The ...
Cypress Semiconductor has collaborated with
Semtech on a compact, two-chip LoRaWAN-based module deployed by
Onethinx. The highly-integrated Onethinx module is ideal for smart city
applications that in...
AAEON announces the launch of the PICO-KBU4, a
rugged and expandable compact SBC with the capacity to revolutionize
the field of robotics and open up the drone market for x86 embedded
Lynx Software Technologies announces the
LynxSecure Safety Bundle for Intel multi-core processors. The
LynxSecure Safety Bundle is an open system architecture solution that
unlocks the potential...
Arrow Electronics has announced a secure
provisioning service that will enable the rapid deployment of IoT edge
nodes and gateways featuring the NXP A71CH Secure Element trust anchor.
The ability to a...
Kontron announces the KBox B-201, a high
performance, compact design computer, as a new member of the Kontron
Embedded Box PC family. State-of-the-art 7th Gen Intel Core processors
together with an In...
With the SensorShield-EVK-003, ROHM is offering a
new sensor shield expansion board equipped with eight sensor boards
designed for use with existing open platform MCU boards such as Arduino
With support of NXP’s S32V234 automotive multicore
SoCs by the Universal Debug Engine (UDE), PLS Programmierbare Logik
& Systeme now provides also optimized testing and debugging
tools for 6...
Renesas announced an update to its “Embedded
Target for RH850Multicore” model-based development environment for
multicore microcontrollers for automotive control applications. The
Maplesoft announced a new release of MapleSim, the
advanced system-level modeling tool. From digital twins for virtual
commissioning to system-level models for complex engineering design
Würth Elektronik expands its product family of
MagI³C power modules with the compact MagI³C VDRM (Variable Step Down
Regulator Module) in a LGA-16EP package. The module has an input vol...
Swissbit announce the introduction of a new
product range of USB 3.1 flash drives. The new USB sticks fulfill the
tough requirements of flash memory for industrial use. The series is
based on a highly...
ARBOR Technology announces the availability of the
Intel Apollo Lake Processor for its fanless Industrial Panel PCs. The
LYNC-712 and LYNC-715 have been upgraded to Intel Pentium N4200
Quad-Core CPU w...
The current lineup of highly integrated
system-on-modules with NXP Layerscape and Power Architecture CPUs by
MicroSys, feature a custom supervision and power controller. For this
purpose, a NXP Kineti...
Laird has expanded its thermoelectric module (TEM)
product family to protect critical electronic devices in emerging
applications found in high temperature environments. This typically
occurs in outdo...
ADLINK Technology has joined forces with Fair
Friend Group (FFG) to develop the new ROS2 toward Converged 5G for
Factories of the Future project. The collaboration integrates wireless
5G network techn...
Energy systems require high reliability,
performance, security and scale across the critical infrastructure.
With RTI Connext DDS, Real-Time Innovations provides a solid foundation
for advanced and in...
Rigol introduces four new high-end oscilloscopes
with a large 10,1“ touch-color display. The MSO/DS7000 is a versatile
mixed-signal high-performance oscilloscope that incorporates many of