EETimes/EDN Europe - weekly Newsletter for Electronics Engineers
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Design and Build with Analog Devices
Analog Devices brings expertise and premium-quality solutions to the industry, with a broad portfolio of components in Automotive, IoT, and Motor and Power Management.
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Arm is better positioned as a privately held company to take a strategic approach for long-term growth as it addresses the IoT market, according to Rajeev Misra, CEO of SoftBank’s $100B Vision Fund and a director of the SoftBank Group.
NXP introduces a programmable logic unit (PLU) to the LPC family of Microcontrollers. Join us for this webinar to see how easy it is set up the PLU as we will explore several real-world examples of the challenges many face, but can be overcome with this unique feature.
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Amphenol LTW USB Type C IP67 Connectors support USB 3.1 standard with a 10Gbps top speed and 5A max. power supply. The standard allows for bi-directional power which makes these new plugs and jacks a one-piece solution for data and power transmission without the need for a separate power adapter.
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In order to drive motors at high efficiency, it is necessary to consider a variety of factors, including construction of the motor, components, and drive method. This series will introduce some basic concepts for achieving high efficiency motor drive.
IEC 62443 is a comprehensive standard for industrial security and widely praised for its use of practical but effective countermeasures. In this webinar, Infineon’s industrial security experts will provide an introduction to IEC 62443.
Addressing the mobile wallet ecosystem, NXP Semiconductors has developed an end-to-end hardware and software solution for OEMs looking to add mobile payment capability to wearable, mobile, or IoT devices.
In this webinar, you will learn more about ST Power Modules, how to reduce your design time and efforts with ACEPACK product portfolio of highly-integrated, high-efficiency power modules for flexible and robust designs ranging up to 30kW.
powerlosstester presenting BsT-pulse 3 phase version and BsT-SQ for powerloss measurement of inductive components new findings of tester, the highest Bs ferrite material D9B for SiC application GaN fe...
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Take advantage of Silicon Labs’ wireless connectivity portfolio, the widest range of protocols including Bluetooth®, Wi-Fi™, Sub-GHz, 2.4 GHz Proprietary, Zigbee, Thread® and multiprotocol solutions.
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In this video an engineer from AnDAPT describes their new programmable power solution and their partnership with Würth at the APEC exhibition in San Antonio, Texas. Drawing from Würth&...
Industrial systems often include FPGAs that, when supported by safety data packages for calculating failure rates, can play a pivotal role in streamlining safety assessments. When these devices are also flash-based and therefore immune to single event upsets (SEUs), FPGAs enable safety system developers to dramatically simplify their designs.
The risk of IoT devices being attacked, modified or misused is high. As such, secured software updates are one of the most critical features of connected devices. This paper provides a comprehensive summary of theoretical approaches and recipes for practical implementation.
Semiconductor industry analysts and market watchers expressed concern after U.S. President Donald Trump announced that the U.S. would impose 25% tariffs on $50 billion of Chinese goods, including many products in the semiconductor supply chain. U.S. chip firms and their suppliers largely oppose the tariffs and the escalation of a trade war between the world’s two largest economies...
Winbond’s new NAND Flash IC offers reliable, lower-cost alternative to SPI NOR Flash in 1Gbit and 2Gbit capacities for automotive displays and instrument clusters. It features a high data-transfer rate of 83MB/s via a Quad Serial Peripheral Interface (QSPI) and supports a two-chip dual quad interface which gives a maximum data transfer rate of 166MB/s.
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Arrow now offers Delivered Duty Paid (DDP) shipping. This means we take care of shipping arrangements, costs, import formalities, and export licenses. Learn more about DDP at Arrow.com.
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Emerging memories likely will find high-volume markets in embedded applications replacing NOR flash for storing code in MCUs and ASICs. “At some point the door is going to close on NOR because of scaling issues, and all MCU and ASIC makers and their logic foundries will need a new non-volatile memory technology…”
In this webinar the advantages of IGBT modules with integrated shunts as an alternative to Hall Effect sensors will be introduced. The attendee will learn why shunt modules enable a reduction of mechanical components, inverter size, production effort and risks, which finally leads to significant reductions in system costs of the inverter design.
Let's take a high-level look at the design modifications that an LED-driver manufacturer might need to make to support the new standard. The new standard (the "V1 Specification") addresses mechanical and electrical as well as software interfaces…
While some 5G products – radios, power amplifiers, and phased arrays – have begun to appear and many more are in development and prototyping, research continues at universities around the world.
While Connected Home adoption continues to expand, we are looking ahead to the next phase, developing the technology that will guide the transition to homes that grow more proactive and automated than we can currently imagine.
EE Times has learned that Wave Computing, a startup focused on the development of AI systems using its massively parallel dataflow architecture, will announce that it has acquired MIPS Technologies, a storied but beleaguered Silicon Valley company that developed MIPS processor architecture and related processing cores.
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