EETimes/EDN Europe - weekly Newsletter for Electronics Engineers
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Doing
more processing at the edge to avoid sending sensitive data to the
cloud emerged as a common theme among vendors at the Embedded World
conference here last week. Whether this is a result of forthcoming GDPR
laws coming into force across the European Union on May 25, or whether
there it is simply a lack of sufficient security in current devices is
difficult to tell.
While
solder fatigue and wire lift offs have been the main limiting factors
for the lifetime of conventional modules, new technologies for assembly
and packaging of semiconductors have emerged and new module generations
achieve much longer lifetime. This webinar will provide you some
guidance for the selection of the most reliable material combination
and design of the substrates.
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This
spring Atlantik Elektronik holds seminars about the creation of
customized Linux distributions and how to develop smart connected
products with latest technologies like Wi-Fi, BT and LPWAN.
Participants acquire detailed knowledge about secure industrial
embedded solutions.
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Increased
diversity among power solutions is natural; given that the application
space for electronics and semiconductors continues to become more
diverse. To make good development decisions, system designers must know
the strengths and trade-offs of these competing power technologies. In
addition, gaining insight into what lies ahead in power technology
evolution, can help system and design engineers plan for the future.
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In
this webinar you will learn about the advantages and disadvantages of
mainboard versus COM modules with customized or modular carriers and
what are the pros and cons of an integrated COM system solution vs
choosing piece parts from different vendors. We will discuss which
solution is in terms of quantity, complexity, project duration and
long-term availability.
3D
offers a new approach to meet the challenges faced by today's
integrated circuits and information technology. A 3D-ROM uses a 3D
physical structure to extend the Moore's Law and is now in mass
production. As an extension of the 3D-ROM, a 3D computation device uses
a 3D computer architecture to satisfy the critical requirements for
high-performance computing tasks ranging from artificial intelligence
to super-computing.
As an architecture for building complex systems, microservices is
gaining significant traction within the development community. The
adoption is on the rise, but so are the struggles associated with
understanding how to test microservices.
Even
without attending Mobile Word Congress (MWC), I can tell that's it's a
place where the big news is all about the latest phones and the like.
But, a lot more went on this week in Barcelona. With 5G all the talk,
many companies are jockeying for position in this new wireless world.
For those of us who stayed home, here are a few announcements that came
my way.
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This
is the eleventh article in a series about my career experiences in the
PCB design industry. During my relatively long employment at Mentor
Graphics, I worked on many different projects. This article is about
the three most significant ones after Team Design, which was described
in the previous article.
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2018
has the potential to mark the realization of the truly digital supply
chain for some electronics OEMs. The potential upside of this shift is
huge in terms of capturing competitive advantage, especially for the
high-tech and electronics manufacturing sector. The shift will bring
with it the potential of growing pains as organizations revamp
technology, process, and procedures in new ways.
Today
we are entering an era in which machines adapt their behaviour to
humans, rather than the other way around. In this webinar you will
learn about the latest Human Vision Components and about OKAO, a
software which includes ten different sensing technologies related to
human recognition.
ARM
announced four new cores for mainstream smartphones and digital TVs,
two Mali GPUs and associated video and display cores for them. The news
shows that Arm is, at least for now, taking a three-tier approach to
machine learning and that China mobile OEMs are becoming increasingly
influential.
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LED
and RF chip vendor Cree said it paid about $430 million to acquire
Infineon Technologies' RF Power business in a move to bolster the
offerings of Cree's Wolfspeed subsidiary in wireless, including faster
4G and 5G networks.
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