EETimes/EDN Europe - weekly Newsletter for Electronics Engineers
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This newsletter informs you once a week about the latest news in technology and products as well as technical know-how like white papers, webinars, articles, etc. from AspenCore’s media, including EETimes, EDN, Electronic Products, EEWeb, Electronics-Know-how and many more. |
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Photovoltaic systems commonly include a means of energy storage – batteries or supercaps – to provide electricity to the load when sunlight is not available or during power transients. However, when feasible, storage-free systems are an environmentally-friendlier alternative with higher MTBF.
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As the Flash market prepares to standardize on new low-voltage ICs, Winbond – the world’s biggest supplier of serial NOR and serial NAND Flash – has demonstrated the feasibility of producing high-performance serial Flash ICs that operate from supply voltages as low as 1.2V.
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The Flash market prepares to standardize on new low-voltage ICs. In this webinar you will learn about Winbond’s high-performance serial Flash ICs that operate from supply voltages as low as 1.2V.
Global semiconductor sales topped $100 million in a quarter for the first time in the third quarter, reaching $107.9 billion, according to the Semiconductor Industry Association (SIA) trade group.
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While secure communication might be on everyone's mind, few are aware of the layers of security already present, and what steps are required to make the future safer. This article summarizes some existing security mechanisms, and outlines a few principles that could shape the future of IoT and Cloud security.
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Part 1 of this series provided an overview on using reflectometry for a pulse plethysmograph (PPG) waveform and described the physical and physiological principles at work.
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Chip vendors implement new applications in CPUs. If the application is suitable for GPUs and DSPs, it may move to them next. Over time, companies develop ASICs and ASSPs. Is Deep learning is moving through the same sequence?
Lama Nachman, Director of Anticipatory Computing Lab at Intel, gave the Keynote entitled ‘Context is Everything’ in which she told us that we have not yet reached the true potential of MEMS/Sensors.
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Thermal management of medical imaging systems is more challenging than ever. Given the complexity of some PET and SPECT systems, the use of a custom designed liquid cooling systems with plug-and-play components may be a good solution.
The wireless connectivity options for the Internet of Things (IoT) are numerous and varied. That there are so many options is in part a function of the growing number of IoT use-case categories, each having a distinct set of requirements that balance factors including power, connectivity range, network latency, the frequency and size of data exchange, and the location(s) of processing resources.
The tricky task of charging battery cells in an electric vehicle within the shortest amount of time possible lies in "battery balancing."
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Today’s state of the SiC MOSFET indicates resolution on major commercial impediments including price, reliability, ruggedness, and diversification of suppliers. In spite of a price premium over Si IGBTs, the SiC MOSFET has already seen success due to cost-offsetting system-level benefits; the market share for this technology will increase sharply over the next few years as materials costs fall.
Selecting the right coding standard is an essential building block for safe and secure coding. This white paper looks more closely at the details that need to be considered so that the coding standard chosen is fit for purpose.
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