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This newsletter informs you once a week about the latest news in technology and products as well as technical know-how like white papers, webinars, articles, etc. from AspenCore’s media, including EETimes, EDN, Electronic Products, EEWeb, Electronics-Know-how and many more. |
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Optical sensors represent the most common type of biosensor. This two-part series provides a technical background on how optical techniques are used for bioanalytical applications. This article provides an overview on using reflectometry for a pulse plethysmograph (PPG) waveform and describes the physical and physiological principals at work.
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Learn how new Winbond memory improves your data security, power consumption and design flexibility.Learn More!
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Many companies do not want to see their entire production data and know-how to be stored and processed outside the companies’premises. The proven solution to this challenge are approaches like edge and fog computing. In this webinar you will learn how modular systems based on the well-established and tested COM Express modules provide an efficient solution.
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Microsemi until recently was addressing only 35-40 percent of the FPGA market. The launch of its mid-range PolarFire FPGAs, with up to treble the logic density, has increased the market Microsemi could serve by $1 billion.
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This webinar will review laminated busbar designs and advise some techniques on how to optimize design by avoiding common mistakes. The webinar is beneficial for mechanical and electrical engineers involved in developing inverters, battery systems and other critical applications.
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The cloud service is changing practically everyone’s business. The chip business could be next. “FPGA as a service” is emerging as a cloud application in data centers. If it starts to take off, how will FPGA vendors like Intel or Xilix respond?
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The higher-speed Ethernet ecosystem is here. Growing bandwidth requirements from increasing cloud adoption is making 400GbE and the faster networking speeds it entails an essential milestone in the drive toward true terabit Ethernet.
Many carmakers, in order to increase the real-world situational awareness of their highly automated vehicles, have already accepted the necessity of literally surrounding every chassis with different types of sensors. What’s not given, however, is the quality of these sensors. How much better do they have to get?
There's a changing of the guard about to take place at the world's largest electronics company, and even its top executives don't know where its leading.
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The Integrated Circuit temperature sensors have been inadvertently part of device design since the beginning of the IC days. IC designers have gone through numerous contortions to minimize temperature effects in their chip systems. But the tables have turned. At one point, an IC designer had a brilliant idea.
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Winbond’s ultra-low voltage serial NOR Flash memory can work between 1.14V to 1.60V, which covers most of the single AA battery operation voltage range. It doesn’t need to change the software or firmware since the command set is compatible with legacy products.
Supporting safety critical applications is at the core of car-to-car communication, and for years, the technology of choice has been IEEE802.11p. Recently, a new standard has started evolving: LTE-V2V. This White Paper compares the two standards on which the safety of millions of road users will depend on.
In this webinar we discuss three TI reference designs that help designers create smart technology that can be integrated into smart home ecosystems. These designs are easy to retrofit into existing homes.
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