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This newsletter informs you once a week about the latest news in technology and products as well as technical know-how like white papers, webinars, articles, etc. from AspenCore’s media, including EETimes, EDN, Electronic Products, EEWeb, Electronics-Know-how and many more. |
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The Internet of Things is a quantum technology leap for the manufacturing industry, enabling business opportunities and competitive inroads that were not possible before. We have put together for you a Microsite with White Papers and E-Books about the digital transformation for the Manufacturing Industry and how Windows 10 can help to drive this transformation.
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Renesas has responded to the IoT challenge to operate at ultra-low power in standby yet be ready to come alive immediately with new embedded SRAM technology. The key to reducing SRAM on/sleep power ratio has been to reduce transistor leakage current, which Renesas has done by deploying its 65-nm silicon-on-thin-buried oxide (SOTB) process to the development of embedded SRAM.
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The INA180 is a family of cost-optimized, current-sense amplifiers that sense voltage drops across current-sense resistors at common-mode voltages from –0.2 V to +26 V, independent of the supply voltage. The INA180 integrates a matched resistor gain network in four, fixed-gain device options.
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Soft-switching techniques are an interesting solution in switched mode power supplies to achieve high efficiency at high switching frequencies. This webinar focuses on Phase-Shift Zero Voltage Switching (PS ZVS) topology, with special attention on the power semiconductors. More specifically, the benefits of using 1200 V silicon carbide (SiC) power devices will be discussed, in comparison to counterpart silicon IGBTs.
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Copper interconnects will get another big turn of the crank with a Gen 5 PCI Express delivering 32 GTransfers/s as early as 2019. The PCI Special Interest Group announced the plan at an annual gathering, where it is still putting finishing touches on its 16 GT/s Gen 4 spec. The news marks a significant acceleration for the widely used computer interconnect, which had hit the pause button for several years as the PC market slowed.
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Designed for SFP, XFP and QSFP transceivers, the ATCTM (Active Transceiver Cooler) Series from Laird ETS removes heat in remote radio units to enable higher data transmission speeds and lower latency in next generation communication networks. The thermoelectric assemblies remove heat to minimize loss in packets of information.
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While Nvidia and Intel are busy sparring for glory as innovators of fully autonomous vehicle platforms, TI sees a different way to get there. Its plan is to use its current ADAS-focused platform to eventually enable Level 4, Level 5 autonomous car. In a recent interview with EE Times, TI said that they have been actively participating in carmakers’ RFQs on models four to five years out.
External media such as SD cards are not going away despite steady expansion of onboard storage capacity. Silicon Motion Technology recently introduced what it said is the first merchant SD controller that supports the latest SD 6.0 specifications and meets the new A2 application performance rating with a minimum random read/write performance of 4,000/2,000 IOPS.
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The FT9xx SuperBridge MCU series provide the ideal configurable bridge between multiple fast interfaces such as Ethernet, Camera, USB Host and device, CAN BUS as well as UART, SPI, QSPI, I2C and I2S.
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The thermal solution for transceiver cooling in an outdoor environment yields an optimal solution to maintain form factor and minimize latency of a remote radio unit. Laird’s ATC line of miniature form factor thermoelectric assemblies provide the size and the cooling accuracy needed to obtain peak performance.
CrossLink is an innovative video bridging solution. This White Paper describes five new applications for Crosslink_ three represent an emphasis on new video bridging solutions, two are traditional interface conversion.
This webinar presented by Siemens PLM Software will show how embedded software development can evolve successfully through a unified Application Lifecycle Management (ALM) - to be unlike your development experience before.
Today, a wide range of connected Embedded Systems is available on the market. And the Industrial Internet of Things (IIoT) is driving the addition of more connected devices. But not only “Connectivity” is essential to the success of the IIoT, “Security” is critical too.
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