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This newsletter informs you once a week about the latest news in technology and products as well as technical know-how like white papers, webinars, articles, etc. from AspenCore’s media, including EETimes, EDN, Electronic Products, EEWeb, Electronics-Know-how and many more. |
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ARM announced its two new application processor cores, the high-end Cortex-A75 and the mid-range Cortex-A55, as part of an ambitious goal to accelerate AI adoption and get an ARM processor core into every IoT device by 2035. The Cortex-A75 offers performance increases versus previous generations, while the Cortex-A55 delivers both performance and efficiency increases.
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Isabellenhütte’s new shunt-based IPC series avoids the interference to current measurement caused by magnetic fields in the past and increases precision. Benefit from this new standard! The 45 minutes webinar on June 7th at 2:00 PM CEST focuses on the technological approach and dialog between experts.
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This webinar presented by Siemens PLM Software will show how embedded software development can evolve successfully through a unified Application Lifecycle Management (ALM) - to be unlike your development experience before.
NI officially introduced LabVIEW NXG 1.0, the first totally rewritten LabVIEW since LabVIEW 2 in 1992 when the first Windows version came out. LabVIEW NXG is a complete rewrite of the underlying code and has been in development for several years. The decision to completely rewrite LabVIEW came about because the LabVIEW 2017 code strain has gotten old and was limiting NI's ability to advance some features.
Direct Bonded Copper (DBC) and Active Metal Brazed (AMB) ceramic substrates are the most popular substrates for the assembly and packaging of IGBT and MOSFET bare dies in power modules. As a designer of power modules, you will have to select the right substrate for your application.
The total value of the global MEMS market is projected to grow from about $13 billion in 2017 to more than $25 billion in 2022, driven largely by growth in RF applications like RF MEMS filters, according to a new report by French market research firm Yole Développement.
The thermal solution for transceiver cooling in an outdoor environment yields an optimal solution to maintain form factor and minimize latency of a remote radio unit. Laird’s ATC line of miniature form factor thermoelectric assemblies provide the size and the cooling accuracy needed to obtain peak performance.
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For the second time in recent years, Mentor is taking a stab at entry-level PCB CAD. As in 2014, Mentor has again teamed with DigiKey to release the $499 PADS MakerPro and the free PADS Maker. And good news for the abandoned Designer folks: these PADS systems will import your files. Not surprisingly, the free version is fairly limited, though not as much as some other free CAD software.
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Advances in AI and robotics will make what was previously impossible possible, and they’re already helping cash-strapped systems save time and money. Let’s take a look at some present-day examples and see what may be in store for the future.
CrossLink is an innovative video bridging solution. This White Paper describes five new applications for Crosslink_ three represent an emphasis on new video bridging solutions, two are traditional interface conversion.
Today, a wide range of connected Embedded Systems is available on the market. And the Industrial Internet of Things (IIoT) is driving the addition of more connected devices. But not only “Connectivity” is essential to the success of the IIoT, “Security” is critical too.
Automakers' requirements for local on-board storage in the vehicle are drastically altering. The need for high capacity storage optimized for the rigorous demands of the automotive environment promises to only accelerate, as the breadth and complexity of the software-driven features in cars evolve.
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