Electronics
News & Know-how covers the latest news in products and
technology, as well as white papers, webinars & more.
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The onus of improving power efficiency in smartphones has often been placed on other components such as the memory or flash storage, but within the next decade they may have self-charging batteries, thanks to researchers at a Canadian university. Montreal's McGill University may eliminate the frustrating experience of being without use of a phone after forgetting to recharge it.
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This webinar presented by Siemens PLM Software will show how embedded software development can evolve successfully through a unified Application Lifecycle Management (ALM) - to be unlike your development experience before.
Machine learning is sparking a new era in computing, according to Nvidia’s chief executive, who hopes that his latest GPU, Volta, becomes its favorite fuel. The Volta announcement was the centerpiece of a two-hour keynote at GTC on “Powering the AI Revolution.” Nvidia’s graphics processors hold a strong position in training neural nets for machine learning...
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The AMC1306 device is a precision,
delta-sigma modulator with the output separated from the input
circuitry by a capacitive double isolation barrier that is highly
resistant to magnetic interference. It offers best linearity, lowest
offset and gain error, and lowest power consumption.
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Western Digital is directing its iNAND embedded flash to the automotive market. The company’s iNAND storage portfolio came with the SanDisk acquisition. Under the Western Digital umbrella, the technology is seeing opportunities for it to meet the evolving demands of advanced driver-assistance systems (ADAS), infotainment and safety systems, and other data storage requirements of connected vehicles.
CrossLink is an innovative video bridging solution. This White Paper describes five new applications for Crosslink_ three represent an emphasis on new video bridging solutions, two are traditional interface conversion.
Silicon Labs’ vice president gives insight as to what’s happening in IoT now. Over the years, Skip Ashton has been listening intently to customer needs with regard to low-power, low-cost connectivity while also tracking and contributing to standards efforts, including zigbee, Fairhair, and the Connected Lighting Alliance.
Today, a wide range of connected Embedded Systems is available on the market. And the Industrial Internet of Things (IIoT) is driving the addition of more connected devices. But not only “Connectivity” is essential to the success of the IIoT, “Security” is critical too.
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The CompactPCI Serial card G232 from
MEN
provides excellent graphics performance with the Radeon E6465 GPU from
AMD. The multi-display controller board can independently control up to
four displays, or combine them into a large display with a common
content via daisy chaining.
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Driving capacitive loads at speed is difficult. The fundamental reason for this is that the current charging due to the voltage change is limited only by the equivalent series resistance (ESR), which tends to be very small for modern multi-layer capacitors. Another reason, if we consider connecting the capacitor to a feedback control system, is phase loss due to a pole introduced by the capacitor...
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Lightfair 2017 took place this year in Philadelphia from May 9-11 and EDN was there to catch the highlights. This year’s event had a stronger focus on the Internet of Things (IoT) with more vendors getting connected. Cree, for example, showcased its new connectivity dashboard that quantified the benefits of a connected building.
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Today, automated metrology systems are implemented throughout the thin film semiconductor manufacturing process. In this paper we will review the emerging trend for metrology systems and the implications for their associated thermal management systems.
This webinar from Infineon will show design engineers how to improve SMPS design in terms of performance, usability and pricing demands. Infineon offers a one-stop-shop service in selecting highly optimized high voltage MOSFETs for various SMPS applications.
Direct Bonded Copper (DBC) and Active Metal Brazed (AMB) ceramic substrates are the most popular substrates for the assembly and packaging of IGBT and MOSFET bare dies in power modules. As a designer of power modules, you will have to select the right substrate for your application.
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The need for mobile healthcare solutions is being addressed more rapidly by a new wave of technology, but serious diagnostics requires still-onerous regulatory compliance The impetus and opportunity for innovation in mobile healthcare has never been higher, and technology providers are stepping up.
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