Power
Electronics News & Know-how covers topics like Power Supplies,
Batteries, Power Semiconductors, Power Components and Thermal Management
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PCIM Preview
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From
16 – 18 May 2017, PCIM Europe covers in Nuremberg/Germany the entire
spectrum of power electronics. Visitors have the opportunity to meet
more than 450 exhibitors from 30 countries to learn about their
products, components and services in all fields of power electronics.
This year, the strongest represented product groups are passive
components (offered by 36 percent of the exhibitors), power
semiconductors (34 percent), thermal management and power converters
(23 percent respectively).
Increasing
demands on power distribution networks have resulted in smaller DC
rails, as well as a proliferation of rails that ensure clean power
reaches the pins of integrated circuits. Meet the challenge of
measuring ripple, noise and transients on today’s low voltage DC power
rails with unknown precision and speed. Learn more at our booth at PCIM
Trade Show. Hall 6, Booth 224
At
the occasion of PCIM in Nuremberg ROHM Semiconductor will showcase its
latest power product novelties for high-speed switching and high power
performance, at the same time meeting the need for greater energy
savings and higher efficiency. Hall 9, Booth 316
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The
LMG5200 device, an 80-V, 10-A driver plus GaN half-bridge power stage,
provides an integrated power stage solution using enhancement-mode
Gallium Nitride (GaN) FETs. The device consists of two 80-V GaN FETs
driven by one high-frequency GaN FET driver in a half-bridge
configuration.
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At
PCIM Europe, Würth Elektronik eiSos will exhibit intelligent drive
technology, renewable energy and energy management. Highlights include
the WE-HCF SMD high current inductor in 2815 package, WE-DPC HV
magnetically shielded, coupled SMD power chokes, extremely efficient
wireless power coils with up to 200 W transferable power and the
shielded LAN transformer WE-LAN AQ.
One
of the highlights at the Rohde & Schwarz booth at PCIM 2017 in
Nuremberg will be the new entry-level R&S RTB2000 oscilloscope for
education, R&D and production. The R&S RTB2000 offers
functionality previously available only in oscilloscopes with a
significantly higher price tag.
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White Papers, Webinars & more
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Circuitry
overcurrent protection rarely receives the attention it deserves. An
inadequately thought out selection of fuses can lead to the breakdown
of equipment and installation, resulting in high replacement costs and
dissatisfied customers. This technical article focuses on the correct
selection criteria for fuses and fuseholders, and should help you take
the more important aspects into consideration.
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This
webinar from Infineon will show design engineers how to improve SMPS
design in terms of performance, usability and pricing demands. With
600V, 700V, and 800V CoolMOS P7 product families, Infineon offers
highly optimized high voltage MOSFETs for various SMPS applications,
covering a wide range of power classes, as low as 5W and as high as
over 10kW. Join the webinar and get introduced to our recommendations
for your SMPS design!
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Direct
Bonded Copper (DBC) and Active Metal Brazed (AMB) ceramic substrates
are the most popular substrates for the assembly and packaging of IGBT
and MOSFET bare dies in power modules. As a designer of power modules,
you will have to select the right substrate for your application. In
this webinar, you will learn how the ceramic grade, the ceramic
thickness and copper thickness are influencing the isolation voltage,
output power and reliability of your module.
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Designing
for highest efficiency performance requires selection of inductors with
the lowest total loss at application conditions. Calculating total loss
can be complicated, but these calculations are built into the Coilcraft
power magnetics tools, making selection, comparison, and analysis as
simple as possible.
In
this white paper we will review two major thermal management systems
that are in use for thin film semiconductor manufacturing and the
emerging trends for metrology systems and the implications for their
associated thermal management systems.
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New Product Annoncements
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Infineon
Technologies introduces the new CIPOS Mini featuring power factor
correction. The intelligent power module (IPM) combines a single switch
boost PFC stage and a 3 phase inverter in one package. With the PFC
integrated into the inverter module...
The
MCP19122/3 Digitally Enhanced Power Analog (DEPA) buck controller suits
dc/dc power conversion. The single-chip solution controls dc/dc
converters and is capable of accepting a high-voltage input (up to 42
V) while regulating an output voltage range from 0.3 to 16 V without
any external components or drivers.
The
DPC series of slim DIN rail ac/dc power supplies are available in 30,
50 and 70 W single output models. All versions accept a universal input
range from 90 to 264 Vac without the need for any input selector
switches.
Toshiba
Electronics Europe has begun sampling a new 40V/3.0A stepper-motor
control IC that requires no external current-sense resistors, and hence
enables more economical and compact drives in equipment such as
printers...
Artesyn
Embedded Technologies today extended its range of low power output
industrial DC/DC converters, targeting a diverse range of applications,
including instrumentation, data communication, telecommunication and
computer peripheral equipment, and industrial automation.
GaN
Systems’ gallium nitride (GaN) transistors are being used by power
inverter design engineers to increase power efficiency, and to reduce
inverter size and weight. These performance advantages have compelled
SolPad, designer...
Allegro MicroSystems Europe has announced a new three-phase brushless
BLDC motor controller for use with N-channel external power MOSFETs.
Allegro’s AMT49413 incorporates much of the circuitry required to
design a cost-effective... |
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