February 20, 2014

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Special Issue:  embedded world 2014 preview

embedded world 2014 highlights
embedded world (Feb 25–27,  in Nuremberg)  is the gathering of the embedded community and the shop window for this innovative market. The 2014 event will present an even bigger range of products, more space and a larger international involvement. This newsletter informs about (product) highlights which will be on show next week.

The World around XMC – Infineon on the Embedded World 2014 
Once again, we are looking forward to amazing you with our latest innovations at this year’s Embedded World. Watch our latest highlights in Industrial, Automotive and Security applications. Visit us in Hall 4 at Booth 550 and get one of 1,000 brand new XMC 2Go development boards for free.

Join ADLINK at Embedded World 2014
ADLINK will present  the following new highlights: SEMA-cloud, 5 new COMs featuring the Intel ATOM E3800 processor, Intel Quark SoC X1000, Intelligent Transportation Systems demonstration, consolidating workloads, new intelligent system platforms, ATCA application ready intelligent platform, EN50155 compliant transportation platform. Hall 1, booth 538 

Cadence@embedded world - Early Software Development. Fast Prototyping.
Cadence shows its latest system development solutions focusing on advanced driver assistance systems, early software development, and integration and co-verification of embedded subsystems with Cadence® System Development Suite. Visit us in hall 4, booth 116

See MSI’s Bay Trail MB, HMI Panel PC, and 4 Gen Fanless System at EW 2014
MSI is showing its latest innovations at EW 2014, which includes Bay Trail and 4th Gen embedded boards, wide-temperature fanless embedded system with 4th Gen CPU, 10.4”/15”/17”/19” HMI Panel PC, as well as its complete solutions of EPIC, COM Express, 3.5”, Mini-ITX, Micro-ATX, and ATX mainboards. You’re cordially invited to see MSI at Hall 1, booth 307

Visit the Axiomtek Team at Booth 1-328 at Embedded World 2014 in Nürnberg
We will showcase innovative embedded solutions using the newest 4th Generation Intel® Core™ processors (formerly codename: Haswell) and Intel® Atom™ processors (formerly codename: Bay Trail). Our top sales and experts will be on hand to answer technical questions and provide solutions. Please visit us at Hall 1, booth 328

Meet the FPGA, DSP, ARM and Boundary-Scan Experts
All embedded, all sizes: Custom designs and off-the-shelf boards. Based on Altera or Xilinx FPGAs, Analog Devices or Texas Instruments DSPs or ARM processors. Plus JTAG Boundary-Scan tools for production testing. Meet the real-time, embedded design experts of A.R. Bayer DSP Systeme and don’t miss our tasty coffee and great expert advice. Hall 4A, booth 101

COM Express connector system Colibri®: Maximum flexibility!
ept now offers the COM Express connector system Colibri® in multiple versions for maximum flexibility: plug and receptacle are available with 220 or 440 pins as well as for 5mm or 8mm stacking height. Colibri® products are compatible with the connectors available on the market, proved by signal integrity tests performed by the Fraunhofer Institut. Hall 4, booth 253

NEW COM Express Type 6 and Type 10 Carrier Boards from Connect Tech!
Connect Tech releases, a COM Express + GPU Embedded System; offering an Intel®i7 processor with your choice of NVIDIA GeForce GT 745M or AMD Radeon E6760 GPU for driving multiple displays or for use as a parallel processor.  Other new Type 6 and Type 10 COM Express carriers on display. Hall 2, booth 318 

Maxim: analog integration solutions for energy management
At 2014 Embedded World, Maxim will demonstrate the unique advantages of highly integrated analog solutions. Maxim hosts interactive demo kiosks with embedded solutions for energy management, power management, and the signal-chain. All Maxim products feature high integration for substantial savings in space, cost, energy, and time to market.

Microsemi to present innovative semiconductor and system solutions
Microsemi will be participating in Embedded World 2014, where the company will showcase its semiconductor products and solutions that tackle the challenges of embedded systems. Company representatives will address how Microsemi’s innovative products balance processing horsepower and connectivity of embedded systems with high-performance, low power, reliability and security.

published by ICC Media.