• Toshiba: structured ASICs for European customers
• Gleichmann: low power 5.7-inch displays with QVGA or VGA resolution
• Holtek: Tinypower MCU for 3D Glasses comes in 16-pin SSOP package

	Sponsor Message
	DAVE™ - Making XMC Coding Easy DAVE™ developers can generate the software library to efficiently use the application optimized peripherals of the XMC MCUs. Code generation is based on application-oriented software components called DAVE™ Apps. DAVE™ can be downloaded free.

• ams: secure payment transactions on µSD and µSIM cards
• Mouser stocks NXP LPC800 series Cortex-M0+ MCUs
• Electronic Assembly: 5.7" color display includes touchscreen capability
• Altera to build next-generation FPGAs on Intel’s 14 nm tri-gate technology

• MathWorks announces release 2013a of MATLAB and Simulink
• dSPACE: SYNECT supports centralized signal and parameter management
• GrammaTech: static analysis tool for binaries identifies security vulnerabilities

	Sponsor Message
	Rapid Prototyping for Microcontrollers The mbed™ platform by ARM delivers free tools and software that enable effective rapid prototyping with ARM® Cortex™-M series processor-based microcontrollers.

• Visure streamlines requirements lifecycle management
• Curtiss-Wright adds event analysis tool to CHAMP-AV8 Continuum Insights suite
• TI: SoftwarePac features production ready PHY and transport software

• SECO unveils ARM based μQseven Rel. 2.0 compliant modules
• Lime: open source RF hardware project simplifies access to inexpensive boards
• ACCES I/O: PCI-104 RS-232/422/485 serial communication boards

Sponsor Message

3rd Gen. Intel® Core™ CompactPCI Serial CPU Board The CPS3003-SA is a highly integrated 3U CPCI-S.0 a multi-core CPU board, scalable from the dual-core ULV 1.7 GHz Intel® Core™ i7-3517UE up to the quad-core 2.1 GHz i7-3612QE processor. Memory-demanding applications can make use of up to 16GB 1600MHz DDR3 SDRAM with Error Checking and Correction (ECC). As additional security feature the CPS3003-SA provides a Trusted Platform Module (TPM).

• Pentair: modular embedded systems between 19" and COM
• Rutronik becomes European distribution partner of DFI
• MicroMax: error-free rugged computer for on-board and off-the-shelf applications
• Eurotech: DuraNET 3000 passes certifications for MIL-STD-810G and MIL-STD-461F
• TQ: modular data logger and gateway for fast systems solutions
• congatec: Qseven Mobility Kit includes smart battery module

A beginner’s guide to to the AMD Embedded G-Series APU with OpenCL
This paper provides an introduction to the AMD G-Series APU and operating systems that support these devices. It also introduces the reader to the OpenCL framework and programming model and contains an in-depth tutorial.

Microcontrollers & Tools
“Low power” and “ARM-based” are still hot topics in the MCU market, as you will see in this free Virtual Conference about Microcontrollers & Development Tools.

Sponsor Message

2nd Smart Grid Forum – March 21&22 in Munich Don´t miss it! This year's forum will focus on grid connection and the safety impact of potential cyber attacks on critical infrastructures. Network operators, international smart grid experts and manufacturers of automation components will share their experience and discuss new concepts and upcoming standards. The conference will be held in English and German with simultaneous translation.

Building the new world of intelligent systems
A new era of pervasive computing is upon us. The proliferation of devices, connections, and data is weaving computing into every aspect of daily life, making possible unprecedented opportunities for innovation, advancement, and growth on a global scale.

New MISRA C:2012 Coding Guidelines Webinar
Publication of the new MISRA C:2012 coding guidelines is imminent. Join Paul Burden – PRQA’s representative on the MISRA C Working Group for more than 10 years and one of the co-authors of the new guidelines - for a webinar and Q&A on 21st March to find out more and understand how the changes are going to affect you.

published by ICC Media.