Daily Newsletter from embedded world 2013- Tuesday, Feb 26

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	Best practice COM technology for your target market MSC‘s Embedded Computer Technology division is specialized in design and manufacturing of highly integrated standard board level products as well as customer specific boards and systems. All our products can be easily tailored to satisfy requirements for volume OEM customers. Our COM Modules: COM Express, Qseven™, ETX®/ET(e), EXM32, nanoRISC®.

embedded world 2013 has opened doors

embedded world, the biggest exhibition of its kind and the meeting-place of the international embedded community, has opened its  doors today. Last year, more than 870 exhibitors showed more than 22,000 visitors the full range of products for embedded technologies.  And even more visitors are expected this year. Our daily embedded world newsletter informs about (product) highlights which are on show from Feb 26 to 28 in Nuremberg.
 

Jan/Feb 2013

Embedded World Special Issue of ECE/Boards & Solutions Magazine Cover Story A Simpler Blueprint for the Internet of Things embedded world Preview Exhibition Overview Exhibitors List Chips & Tools Highlights Boards & Modules Highlights

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You can find all the latest embedded solutions at the ADLINK booth We provide the most advanced embedded computing platforms and solutions based on Intel® processors and chipsets available at Embedded World 2013. Come and discover COM Express® computer-on-modules, Extreme Rugged™ solutions, CompactPCI® blades, AdvancedTCA® blades, industrial SBCs and motherboards, fanless embedded computers and Industrial Mobile Handheld Devices. Hall 1, Stand 532.

Swissbit and HCC demonstrate fail-safe embedded storage system
Swissbit and HCC Embedded will demonstrate a completely robust, fail-safe embedded storage system at the Embedded World. The system is based on a combination of Swissbit’s Industrial SD Card and HCC’s SafeFAT fail-safe file system.

Fujitsu: ARM Cortex-M solutions on show
Fujitsu Semiconductor Europe will be showcasing its FM Family ARM Cortex-M-based industrial solutions and FRAM at Embedded World. The FM Family offers a wide operating voltage range, including real 5 V operation.

Atlantik presents Greenvity´s HomePlug Green PHY for LED lighting
Atlantik Elektronik introduces the latest member of Greenvity Hybrii family, the new Hybrii-Mini GV7013. This chip is compatible to the PLC HomePlug Green PHY for Smart Grid applications and is ideal for intelligent LED lighting systems over long distances within the commercial, public and private sector. 

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	Simplifying Humidity Measurement Relative humidity (RH) sensing is critical to a wide range of applications. Despite its necessity across many industries, RH measurement poses technical challenges for environmental sensing. Download this white paper to review the basics of RH sensing and learn how to simplify humidity measurement.

Xilinx demonstrates Zynq-7000 applications at embedded world
Xilinx will demonstrate applications utilizing its Zynq-7000 All Programmable System-on-Chip and its supporting ecosystem at Embedded World 2013. Multiple demonstrations will showcase advanced applications in automotive driver assistance systems, machine vision, biomedical sensing and industrial applications.

ST: ARM Cortex family supported by SEGGER enables richer user interfaces
STMicroelectronics has delivered first samples of a new microcontroller family that combines high performing ARM Cortex-M4 core running at 180MHz and graphics-related enhancements, enabling richer user experiences. Simultaneously, ST is delivering increased software support for embedded graphics development in conjunction with SEGGER.

TI spins motors in minutes with sensorless, brushless DC motor drivers
Texas Instruments introduced two 3-phase, brushless DC motor drivers that allow designers to spin motors in minutes. Traditional BLDC motor designs require five to 10 components, along with firmware. The sensorless 5-V, 680-mA DRV10866 and the 12-V, 1.5-A DRV11873 cuts this component count to one with no firmware required, significantly reducing board space and system costs.

SiLabs: long-range wireless Internet connectivity solutions
Silicon Labs and SIGFOX announced a first-of-a-kind collaboration for the rapidly emerging IoT market. The combination of Silicon Labs’ EZRadioPRO wireless transceivers and SIGFOX’s Ultra-Narrowband technology enables long-range wireless Internet connectivity solutions for a wide array of devices such as smart meters, patient monitors, security devices, street lights and environmental sensors.

Berner & Mattner: improved change management for IBM Rational Statemate models
Berner & Mattner’s new PowerDiff version 9.1 facilitates the development of complex systems with IBM Rational Statemate. PowerDiff is the only graphical diff tool for IBM Rational Statemate models and ensures model consistency as well as traceability of changes during the system’s entire life cycle.

IAR supports XMC1000 ARM Cortex-M0 MCUs from Infineon
IAR Systems announces comprehensive support for the XMC1000 family of 32-bit microcontrollers recently announced by Infineon. The support is available using IAR Embedded Workbench for ARM, which is a complete set of high-performance tools for embedded development.

HCC and Atollic accelerate the debug process for engineers
HCC Embedded and Atollic announced the release of an advanced product that accelerates the debug process for engineers using Atollic’s TrueSTUDIO C/C++ IDE and HCC’s eTaskSync verifiable task scheduler. Atollic TrueSTUDIO v4.0 will be launched at the Embedded World. The TrueSTUDIO debugger will provide kernel aware debugging for HCC’s eTaskSync scheduler to give engineers a means to debug embedded systems rapidly.

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	Rapid Prototyping for Microcontrollers The mbed™ platform by ARM delivers free tools and software that enable effective rapid prototyping with ARM® Cortex™-M series processor-based microcontrollers.

LieberLieber and SparxSystems: solutions for model engineering
At embedded world, LieberLieber Software and SparxSystems Software show their solutions for model engineering on a joint booth. Sparx Systems` Enterprise Architect isn a powerful UML model platform used by over 300.000 users all over the world. For the first time LieberLieber`s EnArSys - Systems Engineering and Functional Safety Management (FSM, ISO 26262) with Enterprise Architect – will be presented.

iSYSTEM: integrated software development with Vector
iSYSTEM and Vector present the integration of CANoe.XCP, CANoe.AMD as well as CANape and iSYSTEM winIDEA/testIDEA. With their cooperation, iSYSTEM and Vector respond to the demand for consistent development tools and automated test tools required especially by the automotive industry. So far, the two partners have covered different stages of the development and test process

Agilent: universal flash storage protocol-decoding software for oscilloscopes
Agilent Technologies introduced a software solution for decoding the Universal Flash Storage protocol on oscilloscopes. The new protocol decoder provides design and validation engineers with a fast, easy way to validate and debug their UFS interfaces. UFS is a flash storage specification for mobile devices, smartphones, digital cameras and other consumer electronics.

DATA MODUL: Pico-ITX SBC with Freescale Vybrid CortexA5 and CortexM4
The PicoITX form factor with armStoneA5 is perfectly suitable for the development of powerful applications. The Dual Core Vybrid from Freescale has a CortexA5-500MHz core unit and a CortexM4-167MHz core. With the armStoneA5 DATA MODUL is offering a small, strong and extremely cost efficient SBC.

DSM: flat embedded system of the third generation
DSM Computer presents at the embedded world for the first time the NanoServer NN-QM67 embedded system. The 58 mm flat industrial computer is based on Intel Core processors of the third generation and on the energy-saving Intel QM67 mobile chipset. With the compact, slot-less NN-QM67, DSM augments its NanoServer family whose models differ in the number of slots and in the performance class

congatec: COM Express entry modules with 3rd gen Celeron dual-core
congatec introduces Intel Celeron  Dual-Core processors  with 3rd Generation Intel Core technology for the conga-TS77 (type 6) and conga-BS77 (type 2) COM Express module. The module provides impressive performance and improved energy efficiency at a low price point. The conga-TS77 and conga-BS77 modules are now available with   new processor variants.

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MSI launch MS-9A29 fanless 3.5” system uses Intel Atom D2550 MS-9A29 fanless 3.5” system uses Intel Atom D2550, DDR3 SO-DIMM and supports HDMI, VGA, Dual Intel GbE LAN and Dual Mini-PCIe. The processor delivers graphics core rendering speeds of 640 MHz while maintaining excellent power efficiency. The compact 3.5 inch size system gives developers freedom in the design of small embedded applications.

GE: avionics module saves space, weight, power and cost
GE Intelligent announced the RAR15-XMC multi-protocol embeddable avionics module. Featuring both MIL-STD-1553 and ARINC 429 protocols on a single XMC form factor board, the RAR15-XMC is used in a broad range of avionics applications. The RAR15-XMC is the result of one of several  custom developments undertaken on behalf of major prime contractors and systems integrators, and is now available as a standard, off-the-shelf product.

ELMA presents first VITA 46.11 standard system
The advantages of Intelligent Platform Management Interfaces in system monitoring, recent novelties with MicroTCA.4 as well as a compact system optimized for face reognition are the main topics at the ELMA booth at the embedded world. What ELMA computing power can achieve in the security sector shows a small form factor system with camera and integrated face recognition software

published by ICC Media.