August 29, 2012 - presented by
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Sponsor Message |
| DIN Rail PC SmartBrick®: Power for the electrical
cabinet DSM Computer has extended its compact DIN rail-mounted PC family SmartBrick® with a higher performance variant that incorporates an energy-saving Intel® Atom™ processor Z530 (1.6 GHz). Thanks to its shape, the H1-A can be installed in an electrical cabinet e.g. in the building automation, in smart metering and electro-mobility applications. |
- RECOM consolidated its lighting activities in a new division
- Microsemi: advanced die packaging for implantable medical devices
- Digi-Key announces global distribution agreement with Touch Revolution
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Sponsor Message |
| How to Simplify the Addition of Wireless Connectivity
to Your Design Adding wireless connectivity can be difficult given the requirements of consumers and various regulatory bodies and the complex decisions that must be made regarding hardware design and system configuration. Download this white paper from Silicon Labs to learn how to simplify wireless implementation. |
- Codethink: Linux build system for embedded and industrial systems
- Agilent: fully integrated PCI Express 3.0 receiver test software
- Trenz: mixed-signal test and measurement tool targets students’ needs
- GOEPEL opens SCANFLEX platform for third party applications
- HCC: Evatronix NAND Flash controller now available with SafeFTL
- Segger and Carnica announce distribution alliance for Germany
- SYSGO improves ELinOS embedded Linux development environment
- Verotec: slimline high power density 3U 4HP pluggable PSUs
- Moxa: Embedded wireless for serial devices in less time
- MSC: Qseven module with media processor for imaging applications
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Sponsor Message |
| 3rd generation Intel® Core™ processor
technology on 6U CompactPCI® Based on the Intel® QM77 Express Chipset and scalable up to the quad-core 3rd generation Intel® Core™ i7-3615QE processor with 4 x 2.3 GHz (3.3 GHz in Turbo mode) the new boards provide up to 20% enhanced computing power and increased performance per watt compared to designs based on the 2nd generation Intel® Core™ processors. |
- Portwell : COM Express Compact module for medical and defence
- Advantech: signage solutions powered by 3rd gen Intel Core i processor
- Acrosser: network security appliance for VPN, UTM, and VOIP
- IEI: EPIC SBC supports 3rd gen Intel Core processors and QM77 Express chipset
- Axiomtek: fanless desktop network appliance with Atom D525 and 6 Gigabit LANs
Rugged COM Express for harsh
environments
Ensuring COM Express modules and carriers to
perform under harsh conditions is a challenge, but it is possible. This
webinar will explain how.
Renewable Energies
Our Virtual
Seminar about renewable energies provides you with 5 webinars about topics
like energy harvesting, photovoltaic application design, smart metering,
smart grid and more.
Digital signage - entering a new era
Are you
ready for the new era of digital signage? Intel invites you to a webinar,
which discusses new technologies to increase customer benefits of digital
signage solutions.
Wireless Connectivity Guide
Whatever
type of wireless connectivity you need for your next application, TI can
help you find the right one. TI supports more than a dozen wireless
technologies.
Smarter and more focused testing for higher-quality devices
with Wind River Test Management
This White Paper
introduces Wind River Test Management, a new solution for device
manufacturers to improve their test operations and generate business
value. The White Paper also includes a couple of case studies.
published by ICC Media.